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Name: 5M160ZT100C4N
Brand: Intel
SKU: 5M160ZT100C4N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5M160ZT100C4N

Part No.:: 5M160ZT100C4N

Manufacturer:: Intel

Package:: 100-TQFP

Datasheet:: 5M160ZT100C4N.pdf

Description:: IC CPLD 128MC 7.5NS 100TQFP

In Stock:: 2205

Quantity:: Add To Cart

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5M160ZT100C4N Specifications

Package/Case:
100-TQFP
Packaging:
Tray
Series:
MAX® V
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
7.5 ns
VoltageSupply-Internal:
1.71V ~ 1.89V
NumberofLogicElements/Blocks:
160
NumberofMacrocells:
128
NumberofGates:
-
NumberofI/O:
79
OperatingTemperature:
0°C ~ 85°C (TJ)
MountingType:
Surface Mount

5M160ZT100C4N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5M160ZT100C4N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5M160ZT100C4N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5M160ZT100C4N information

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Common technical challenges and solutions when using 5M160ZT100C4N

5M160ZT100C4N is a field-programmable gate array (FPGA) chip manufactured by Intel (formerly Altera), offering high performance and versatility for a wide range of applications in electronics and digital design.

Common Challenges:

When using 5M160ZT100C4N, engineers often encounter several technical challenges, including:

1. Noise Issues: Due to the high-speed switching nature of FPGAs, noise interference can arise, affecting signal integrity and overall system performance.

2. Power Consumption: FPGAs like 5M160ZT100C4N may consume significant power, especially in complex designs or during high computational loads, leading to thermal management concerns and increased operational costs.

3. Integration Complexity: Integrating 5M160ZT100C4N into a larger system architecture requires careful planning and consideration due to its complexity and the need to interface with other components seamlessly.

Solutions and Improvements:

To address these challenges, consider the following solutions and improvement methods:

1. Noise Mitigation: Implement proper PCB layout techniques, such as signal isolation, ground plane partitioning, and differential signaling, to reduce noise coupling and enhance signal integrity. Additionally, utilize filtering components like ferrite beads or capacitors to suppress high-frequency noise.

2. Power Optimization: Employ power management strategies such as clock gating, dynamic voltage and frequency scaling (DVFS), and power-down modes to minimize power consumption during idle or low activity periods. Furthermore, optimize FPGA logic and routing to reduce dynamic power dissipation.

3. Integration Planning: Utilize standardized communication protocols like SPI or I2C for interfacing 5M160ZT100C4N with other system components, simplifying integration and ensuring compatibility. Additionally, leverage FPGA intellectual property (IP) cores or pre-designed modules to expedite development and reduce integration complexity.

4. Thermal Management: Implement effective thermal design practices, including proper heatsinking, thermal vias, and airflow management, to dissipate heat generated by 5M160ZT100C4N and prevent overheating. Consider employing temperature sensors and thermal monitoring algorithms to dynamically adjust FPGA operation based on thermal conditions.

5. Design Verification: Conduct thorough testing and simulation of the FPGA design to identify and address potential issues early in the development cycle. Utilize tools like timing analysis, functional simulation, and hardware-in-the-loop (HIL) testing to validate the design's performance, reliability, and compliance with specifications.

Conclusion:

By implementing these solutions and improvement methods, engineers can overcome the technical challenges associated with using 5M160ZT100C4N FPGA chips, ensuring successful integration and optimal performance in diverse electronic applications.

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6. What is the process for return or replacement of 5M160ZT100C4N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5M160ZT100C4N we delivered, we will accept the replacement or return of the 5M160ZT100C4N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5M160ZT100C4N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations