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Name: 5CGXFC7D6F31A7N
Brand: Intel
SKU: 5CGXFC7D6F31A7N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5CGXFC7D6F31A7N

Part No.:: 5CGXFC7D6F31A7N

Manufacturer:: Intel

Package:: 896-BGA

Datasheet:: 5CGXFC7D6F31A7N.pdf

Description:: IC FPGA 480 I/O 896FBGA

In Stock:: 3313

Quantity:: Add To Cart

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5CGXFC7D6F31A7N Specifications

Package/Case:
896-BGA
Packaging:
Tray
Series:
Cyclone® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
56480
NumberofLogicElements/Cells:
149500
TotalRAMBits:
7880704
NumberofI/O:
480
NumberofGates:
-
Voltage-Supply:
1.07V ~ 1.13V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 125°C (TJ)

5CGXFC7D6F31A7N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5CGXFC7D6F31A7N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5CGXFC7D6F31A7N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5CGXFC7D6F31A7N information

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5CGXFC7D6F31A7N Application Introduction

5CGXFC7D6F31A7N is a versatile FPGA device with a wide range of applications in digital design projects. It offers high performance, flexibility, and reliability, making it suitable for various projects in industries such as telecommunications, automotive, and industrial automation.

Power Management:

To effectively manage power in a design utilizing 5CGXFC7D6F31A7N, consider the following:

1. Power Supply Design:

Ensure that the power supply design provides stable and clean power to the FPGA. Use high-quality voltage regulators and filtering capacitors to minimize noise and voltage fluctuations.

2. Power Consumption Optimization:

Optimize the FPGA design to minimize power consumption by utilizing low-power design techniques such as clock gating, power gating, and voltage scaling. Analyze power consumption using tools like PowerPlay Early Power Estimator (EPE) to identify areas for improvement.

3. Dynamic Power Management:

Implement dynamic power management schemes to dynamically adjust the operating voltage and frequency of the FPGA based on workload and performance requirements. Use techniques such as voltage scaling and dynamic reconfiguration to optimize power consumption during idle or low activity periods.

Signal Integrity:

Ensuring signal integrity is crucial for reliable operation of 5CGXFC7D6F31A7N-based designs. Follow these tips to maintain signal integrity:

1. PCB Layout:

Design the PCB layout carefully to minimize signal distortions, reflections, and crosstalk. Follow recommended guidelines provided in the FPGA datasheet and application notes for proper placement of high-speed signal traces, power/ground planes, and signal routing.

2. Signal Termination:

Implement proper signal termination techniques, such as series termination resistors or parallel termination, to match the transmission line impedance and minimize signal reflections. Use simulation tools like HyperLynx or Signal Integrity Analyzer to optimize termination values.

3. Clock Distribution:

Ensure clean and jitter-free clock distribution by using low-jitter clock sources, proper clock routing techniques, and clock distribution networks with controlled impedance. Minimize clock skew and jitter to maintain timing integrity and reliability.

Thermal Management:

Managing thermal issues is essential to prevent overheating and ensure reliable operation of 5CGXFC7D6F31A7N. Follow these guidelines for effective thermal management:

1. Heat Dissipation:

Design the PCB with adequate thermal vias, heatsinks, and thermal pads to dissipate heat efficiently from the FPGA and surrounding components. Ensure proper airflow and ventilation within the enclosure to facilitate heat dissipation.

2. Thermal Analysis:

Conduct thermal analysis using simulation tools or thermal imaging techniques to identify hotspots and areas of high thermal stress on the FPGA. Optimize the design layout and heat dissipation mechanisms to mitigate thermal issues.

3. Operating Conditions:

Operate the FPGA within its specified temperature range and ambient conditions to prevent thermal-induced failures and ensure long-term reliability. Monitor temperature levels during operation and implement thermal shutdown mechanisms if necessary to protect the device from excessive heat.

Considerations:

When designing with 5CGXFC7D6F31A7N, consider the following additional factors:

- Design Constraints: Adhere to timing, power, and resource constraints specified in the FPGA datasheet and design guidelines.

- Design Validation: Perform thorough simulation, verification, and testing to validate the functionality, performance, and reliability of the FPGA design under various operating conditions.

- Design Security: Implement security features such as encryption, authentication, and anti-tamper measures to protect the FPGA design from unauthorized access, reverse engineering, and intellectual property theft.

5CGXFC7D6F31A7N FAQ

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3. Are the 5CGXFC7D6F31A7N price and inventory displayed accurate?

The price and inventory of 5CGXFC7D6F31A7N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5CGXFC7D6F31A7N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5CGXFC7D6F31A7N we delivered, we will accept the replacement or return of the 5CGXFC7D6F31A7N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5CGXFC7D6F31A7N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations