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Name: 5AGZME5H3F35I4G
Brand: Intel
SKU: 5AGZME5H3F35I4G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5AGZME5H3F35I4G

Part No.:: 5AGZME5H3F35I4G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5AGZME5H3F35I4G.pdf

Description:: IC FPGA 534 I/O 1152FBGA

In Stock:: 2240

Quantity:: Add To Cart

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5AGZME5H3F35I4G Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria V GZ
ProductStatus:
Active
NumberofLABs/CLBs:
18870
NumberofLogicElements/Cells:
400000
TotalRAMBits:
34322432
NumberofI/O:
534
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5AGZME5H3F35I4G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5AGZME5H3F35I4G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5AGZME5H3F35I4G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5AGZME5H3F35I4G information

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5AGZME5H3F35I4G Application Introduction

5AGZME5H3F35I4G is a powerful FPGA device, widely used in high-performance computing, signal processing, and data communication applications. It offers advanced features, including high logic density, versatile I/O options, and efficient power management.

Design Optimization Tips:

To effectively utilize 5AGZME5H3F35I4G in your design projects, consider the following optimization strategies:

1. Power Management:

Efficient power management is crucial for maximizing the performance and reliability of your FPGA design. Implement the following techniques:

- Dynamic Voltage Scaling: Adjust the supply voltage dynamically based on the workload to reduce power consumption during low activity periods.

- Clock Gating: Disable the clock signal to unused sections of the FPGA to minimize power usage. Utilize clock gating techniques to ensure that only active regions consume power.

- Power Islands: Partition the FPGA design into separate power islands, allowing independent control of power to different regions, enhancing overall power efficiency.

2. Signal Integrity:

Maintaining signal integrity is essential for reliable FPGA operation, especially in high-speed designs. Consider these tips:

- Impedance Matching: Ensure proper impedance matching for all signal traces to minimize reflections and signal degradation. Use termination resistors where necessary.

- Minimize Crosstalk: Carefully route signal traces to minimize crosstalk between adjacent lines. Use differential signaling for high-speed signals to reduce susceptibility to noise.

- Controlled Signal Routing: Use controlled impedance PCB stack-up and route high-speed signals on dedicated layers with consistent reference planes.

3. Thermal Management:

Effective thermal management is vital to prevent overheating and ensure the long-term reliability of 5AGZME5H3F35I4G. Implement these strategies:

- Heat Sinks: Attach appropriate heat sinks to the FPGA to dissipate heat efficiently. Ensure proper thermal interface material is used for optimal heat transfer.

- Forced Air Cooling: Utilize fans or blowers to provide forced air cooling, especially in high-power applications. Ensure adequate airflow around the FPGA and other heat-generating components.

- Thermal Monitoring: Implement thermal sensors within the FPGA design to monitor temperature in real-time. Use this data to dynamically adjust the operating conditions to maintain safe temperatures.

Additional Considerations:

When designing with 5AGZME5H3F35I4G, it's also important to consider the following aspects:

- Firmware Optimization: Develop efficient firmware algorithms to optimize the performance of the FPGA. Ensure that the code is optimized for speed and power efficiency.

- EMC/EMI Compliance: Design the PCB layout to minimize electromagnetic interference and ensure compliance with relevant EMC standards. Implement proper shielding and filtering techniques.

- Reliability Testing: Thoroughly test the FPGA design under various operating conditions to verify robustness and reliability. Perform stress testing to identify potential failure points and address them proactively.

By following these design optimization tips, you can effectively harness the capabilities of 5AGZME5H3F35I4G and achieve high performance, efficiency, and reliability in your projects.

5AGZME5H3F35I4G FAQ

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6. What is the process for return or replacement of 5AGZME5H3F35I4G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5AGZME5H3F35I4G we delivered, we will accept the replacement or return of the 5AGZME5H3F35I4G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5AGZME5H3F35I4G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations