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Name: 5AGXMB1G4F35C4G
Brand: Intel
SKU: 5AGXMB1G4F35C4G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5AGXMB1G4F35C4G

Part No.:: 5AGXMB1G4F35C4G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 544 I/O 1152FBGA

In Stock:: 2325

Quantity:: Add To Cart

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5AGXMB1G4F35C4G Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria V GX
ProductStatus:
Active
NumberofLABs/CLBs:
14151
NumberofLogicElements/Cells:
300000
TotalRAMBits:
17358848
NumberofI/O:
544
NumberofGates:
-
Voltage-Supply:
1.07V ~ 1.13V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5AGXMB1G4F35C4G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5AGXMB1G4F35C4G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5AGXMB1G4F35C4G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5AGXMB1G4F35C4G information

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5AGXMB1G4F35C4G Application Introduction

5AGXMB1G4F35C4G is a high-density FPGA device manufactured by Intel, featuring advanced performance and flexibility for various applications in the fields of telecommunications, automotive, and industrial automation.

Application Scenario:

In telecommunications infrastructure, 5AGXMB1G4F35C4G can be utilized to implement high-speed data processing, encryption, and protocol handling in network switches and routers.

Circuit Design:

To effectively utilize 5AGXMB1G4F35C4G in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power distribution and consumption throughout the FPGA device and associated components. Utilize advanced power gating and voltage scaling mechanisms to minimize power dissipation and enhance overall energy efficiency.

2. Signal Integrity:

Design the PCB layout and routing architecture carefully to minimize signal degradation and ensure robust signal integrity. Employ techniques such as impedance matching, controlled impedance traces, and signal termination to mitigate signal reflections and crosstalk, especially in high-speed interfaces.

3. Thermal Management:

Ensure effective thermal management strategies are implemented to prevent overheating and maintain reliable operation of 5AGXMB1G4F35C4G under varying environmental conditions. Utilize proper heatsinking, thermal vias, and airflow optimization techniques to dissipate heat efficiently and prevent thermal-induced performance degradation.

4. Design Partitioning:

Optimize the design partitioning and resource utilization within 5AGXMB1G4F35C4G to maximize performance and resource efficiency. Utilize hierarchical design methodologies, instantiate reusable IP cores, and employ advanced synthesis and optimization tools to streamline the design process and achieve optimal resource utilization.

5. Clock Management:

Implement robust clocking architectures and clock distribution networks to ensure reliable clocking signals throughout the FPGA design. Utilize advanced clocking resources such as PLLs, DCMs, and clock gating techniques to minimize clock skew, jitter, and power consumption while maximizing timing closure and performance.

Considerations:

When designing with 5AGXMB1G4F35C4G, it's essential to consider:

- Design Validation: Perform thorough design validation and verification to ensure functionality, performance, and reliability meet project requirements and specifications.

- Timing Closure: Utilize advanced timing analysis and optimization techniques to achieve timing closure and meet critical timing constraints, especially in high-speed and time-sensitive applications.

- Design Security: Implement robust security features and encryption algorithms to protect intellectual property and sensitive data stored within the FPGA device, especially in applications requiring high levels of security and integrity.

- Design for Testability: Incorporate built-in self-test (BIST) features, boundary scan test logic, and other testability enhancements to facilitate efficient testing and debugging of the FPGA design during development and production phases.

5AGXMB1G4F35C4G FAQ

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3. Are the 5AGXMB1G4F35C4G price and inventory displayed accurate?

The price and inventory of 5AGXMB1G4F35C4G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5AGXMB1G4F35C4G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5AGXMB1G4F35C4G we delivered, we will accept the replacement or return of the 5AGXMB1G4F35C4G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5AGXMB1G4F35C4G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations