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Name: 5AGXFB5H4F35I3G
Brand: Intel
SKU: 5AGXFB5H4F35I3G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5AGXFB5H4F35I3G

Part No.:: 5AGXFB5H4F35I3G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5AGXFB5H4F35I3G.pdf

Description:: IC FPGA 544 I/O 1152FBGA

In Stock:: 3772

Quantity:: Add To Cart

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5AGXFB5H4F35I3G Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria V GX
ProductStatus:
Active
NumberofLABs/CLBs:
19811
NumberofLogicElements/Cells:
420000
TotalRAMBits:
23625728
NumberofI/O:
544
NumberofGates:
-
Voltage-Supply:
1.12V ~ 1.18V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5AGXFB5H4F35I3G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5AGXFB5H4F35I3G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5AGXFB5H4F35I3G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5AGXFB5H4F35I3G information

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5AGXFB5H4F35I3G Application Introduction

5AGXFB5H4F35I3G is a high-performance FPGA (Field-Programmable Gate Array) device, offering unparalleled flexibility and computational power for a wide range of applications.

Application Scenario:

In the realm of telecommunications, 5AGXFB5H4F35I3G can be utilized to implement advanced signal processing algorithms for wireless communication systems, such as 5G base stations.

Circuit Design:

To harness the capabilities of 5AGXFB5H4F35I3G effectively, adhere to the following design guidelines:

1. Power Management:

Implement robust power management strategies to ensure stable and clean power is supplied to 5AGXFB5H4F35I3G and associated components. Utilize dedicated power planes, bypass capacitors, and voltage regulators to minimize noise and voltage fluctuations.

2. Signal Integrity:

Optimize signal routing and minimize signal reflections by adhering to high-speed design practices. Utilize impedance-controlled traces, minimize signal vias, and implement signal termination techniques to maintain signal integrity and reduce jitter.

3. Thermal Management:

Prevent overheating of 5AGXFB5H4F35I3G by incorporating adequate thermal management techniques. Utilize thermal vias, heat sinks, and proper airflow within the enclosure to dissipate heat effectively and ensure reliable operation under varying environmental conditions.

4. Design Partitioning:

Break down the design into manageable modules and utilize hierarchical design methodologies to facilitate efficient implementation and debugging. Utilize the hierarchical design flow offered by FPGA development tools to streamline the design process and enhance reusability.

5. Timing Closure:

Ensure timing closure by meticulously analyzing timing constraints and optimizing the design to meet timing requirements. Utilize advanced synthesis and place-and-route optimizations provided by FPGA design tools to achieve optimal performance and minimize design iterations.

Considerations:

When designing with 5AGXFB5H4F35I3G, consider the following aspects:

- Resource Utilization: Efficiently utilize FPGA resources to maximize design flexibility and minimize resource constraints.

- Design Security: Implement security features, such as bitstream encryption and authentication, to safeguard intellectual property and prevent unauthorized access to the FPGA configuration.

- Testability: Incorporate built-in self-test (BIST) features and debug interfaces to facilitate design validation and debugging during development and production phases.

- Compliance: Ensure compliance with industry standards and regulations, such as FCC regulations for electromagnetic compatibility (EMC) and safety standards, to ensure interoperability and reliability of the final product.

- Design Documentation: Maintain comprehensive design documentation, including design specifications, block diagrams, and test plans, to facilitate collaboration among team members and ensure traceability throughout the design lifecycle.

5AGXFB5H4F35I3G FAQ

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3. Are the 5AGXFB5H4F35I3G price and inventory displayed accurate?

The price and inventory of 5AGXFB5H4F35I3G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5AGXFB5H4F35I3G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5AGXFB5H4F35I3G we delivered, we will accept the replacement or return of the 5AGXFB5H4F35I3G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5AGXFB5H4F35I3G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations