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Name: 5AGXFB3H4F35I3G
Brand: Intel
SKU: 5AGXFB3H4F35I3G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5AGXFB3H4F35I3G

Part No.:: 5AGXFB3H4F35I3G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA Exposed Pad

Datasheet:: 5AGXFB3H4F35I3G.pdf

Description:: IC FPGA 544 I/O 1152FBGA

In Stock:: 3491

Quantity:: Add To Cart

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5AGXFB3H4F35I3G Specifications

Package/Case:
1152-BBGA, FCBGA Exposed Pad
Packaging:
Tray
Series:
Arria V GX
ProductStatus:
Active
NumberofLABs/CLBs:
17110
NumberofLogicElements/Cells:
362000
TotalRAMBits:
19822592
NumberofI/O:
544
NumberofGates:
-
Voltage-Supply:
1.12V ~ 1.18V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5AGXFB3H4F35I3G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5AGXFB3H4F35I3G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5AGXFB3H4F35I3G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5AGXFB3H4F35I3G information

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5AGXFB3H4F35I3G Application Introduction

5AGXFB3H4F35I3G is a high-density FPGA device with advanced features, suitable for a wide range of applications in telecommunications, automotive, and industrial sectors.

Application Scenario:

In telecommunications, 5AGXFB3H4F35I3G can be utilized for high-speed data processing, such as in baseband processing for 5G networks or optical networking equipment.

Circuit Design:

To optimize the design using 5AGXFB3H4F35I3G, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to ensure stable and reliable operation of 5AGXFB3H4F35I3G and associated components. Utilize voltage regulators and power sequencing circuits to provide clean and regulated power to the FPGA.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and other sources of signal degradation. Use impedance matching techniques, proper termination, and controlled impedance traces to maintain signal integrity and optimize high-speed data transmission.

3. Thermal Management:

To manage heat dissipation effectively, incorporate thermal vias, heat sinks, and thermal pads into the PCB design. Ensure adequate airflow and ventilation around the FPGA to prevent overheating and maintain optimal operating temperatures.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to the FPGA and other critical components. Use low-skew clock routing techniques and clock buffer circuits to minimize clock skew and jitter.

5. Design Partitioning:

Partition the design into smaller, manageable blocks to facilitate easier implementation and debugging. Utilize hierarchical design methodologies to promote modularity and reusability, improving overall design efficiency and scalability.

Considerations:

When optimizing the design with 5AGXFB3H4F35I3G, keep in mind the following considerations:

- Resource Utilization: Efficiently utilize the available FPGA resources, such as logic elements, DSP blocks, and memory resources, to minimize resource constraints and maximize performance.

- Timing Closure: Pay close attention to timing constraints and perform thorough timing analysis to ensure timing closure and meet design performance requirements.

- Design Security: Implement security features, such as encryption and authentication mechanisms, to protect the intellectual property and ensure the integrity of the FPGA design.

- Design Verification: Rigorously verify the design through simulation, emulation, and hardware testing to detect and resolve potential design issues early in the development process.

- Design for Manufacturability: Consider manufacturability aspects during the design phase to simplify manufacturing processes and reduce production costs.

5AGXFB3H4F35I3G FAQ

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Currently, icwhale.com only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

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3. Are the 5AGXFB3H4F35I3G price and inventory displayed accurate?

The price and inventory of 5AGXFB3H4F35I3G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5AGXFB3H4F35I3G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5AGXFB3H4F35I3G we delivered, we will accept the replacement or return of the 5AGXFB3H4F35I3G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5AGXFB3H4F35I3G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations