What is the Additional Feature ?

Name: 5AGXA3F31I3NAC
Brand: Intel
SKU: 5AGXA3F31I3NAC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5AGXA3F31I3NAC

Part No.:: 5AGXA3F31I3NAC

Manufacturer:: Intel

Package:: 896-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 416 I/O 896FBGA

In Stock:: 3921

Quantity:: Add To Cart

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5AGXA3F31I3NAC Specifications

Package/Case:
896-BBGA, FCBGA
Packaging:
Tray
Series:
Arria V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
56100
NumberofLogicElements/Cells:
148670
TotalRAMBits:
893952
NumberofI/O:
416
NumberofGates:
-
Voltage-Supply:
1.12V ~ 1.18V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5AGXA3F31I3NAC this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5AGXA3F31I3NAC price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5AGXA3F31I3NAC to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5AGXA3F31I3NAC information

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5AGXA3F31I3NAC Application Introduction

5AGXA3F31I3NAC is a versatile FPGA device offering high-performance capabilities suitable for a wide range of design projects, from telecommunications to industrial control systems.

Power Management:

When integrating 5AGXA3F31I3NAC into your design, efficient power management is crucial to ensure optimal performance and reliability. Utilize low-dropout voltage regulators to supply stable power to the FPGA and associated peripherals. Implement power sequencing to manage the power-up and power-down sequence, preventing potential damage due to voltage spikes or surges. Additionally, consider implementing dynamic voltage and frequency scaling techniques to optimize power consumption based on the workload and operating conditions.

Signal Integrity:

To maintain signal integrity and minimize noise in your design, carefully plan the layout of high-speed interfaces and signal traces connected to 5AGXA3F31I3NAC. Use controlled impedance traces and minimize signal crosstalk by routing critical signals away from noisy components or sources of interference. Incorporate termination resistors and signal conditioning circuits to mitigate reflections and ensure reliable communication between the FPGA and external devices.

Thermal Management:

Effective thermal management is essential to prevent overheating and ensure the long-term reliability of 5AGXA3F31I3NAC in your design. Properly distribute heat sinks or thermal vias to dissipate heat generated during operation. Implement thermal sensors and monitoring circuitry to detect temperature variations and trigger thermal management strategies, such as dynamic clock throttling or fan control, to maintain the FPGA within its specified operating temperature range. Additionally, consider environmental factors and enclosure design to facilitate heat dissipation and airflow around the FPGA device.

Configuration:

When configuring 5AGXA3F31I3NAC for your design project, ensure proper initialization and programming techniques are employed. Utilize non-volatile configuration memory, such as flash memory or configuration PROMs, to store FPGA bitstreams and enable autonomous configuration upon power-up. Implement error detection and correction mechanisms to verify the integrity of the configuration data and prevent configuration failures or errors during operation. Additionally, consider implementing remote configuration capabilities to facilitate in-system updates and reconfiguration without requiring physical access to the FPGA device.

Debugging and Testing:

To streamline the debugging and testing process for your design project involving 5AGXA3F31I3NAC, incorporate built-in self-test (BIST) features and on-chip instrumentation to facilitate functional verification and validation. Utilize debug interfaces, such as JTAG or UART, to access internal registers and observe internal signals for debugging purposes. Implement comprehensive test benches and simulation environments to validate the functionality and performance of the FPGA design under various test scenarios and operating conditions.

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6. What is the process for return or replacement of 5AGXA3F31I3NAC?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5AGXA3F31I3NAC we delivered, we will accept the replacement or return of the 5AGXA3F31I3NAC only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5AGXA3F31I3NAC.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations