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Name: 5AGTFD3H3F40I3G
Brand: Intel
SKU: 5AGTFD3H3F40I3G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5AGTFD3H3F40I3G

Part No.:: 5AGTFD3H3F40I3G

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 704 I/O 1517FBGA

In Stock:: 3957

Quantity:: Add To Cart

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5AGTFD3H3F40I3G Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria V GT
ProductStatus:
Active
NumberofLABs/CLBs:
17110
NumberofLogicElements/Cells:
362000
TotalRAMBits:
19822592
NumberofI/O:
704
NumberofGates:
-
Voltage-Supply:
1.12V ~ 1.18V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5AGTFD3H3F40I3G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5AGTFD3H3F40I3G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5AGTFD3H3F40I3G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5AGTFD3H3F40I3G information

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5AGTFD3H3F40I3G Application Introduction

5AGTFD3H3F40I3G is a versatile FPGA chip commonly utilized in various electronic design projects for its high performance and flexibility. When incorporating 5AGTFD3H3F40I3G into your design, it's essential to optimize several aspects, including power management, signal integrity, and thermal management, to ensure optimal functionality and reliability.

Power Management:

Proper power management is crucial for 5AGTFD3H3F40I3G to ensure stable operation and prevent issues such as voltage droops or brownouts. Consider the following tips for effective power management:

1. Power Supply Design: Design a robust power supply circuit with adequate current and voltage regulation capabilities to meet the power requirements of 5AGTFD3H3F40I3G and its associated components.

2. Decoupling Capacitors: Place decoupling capacitors strategically near the power pins of 5AGTFD3H3F40I3G to minimize voltage fluctuations and provide clean power.

3. Power Sequencing: Implement proper power sequencing to ensure that power rails are powered up and down in the correct order, minimizing potential damage to 5AGTFD3H3F40I3G due to voltage spikes or transients.

4. Low Power Design Techniques: Utilize low power design techniques such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption during idle or low activity periods.

Signal Integrity:

Ensuring signal integrity is essential for reliable communication and operation of 5AGTFD3H3F40I3G within the design. Follow these recommendations to maintain signal integrity:

1. PCB Layout Considerations: Pay careful attention to the PCB layout, minimizing trace lengths, avoiding signal crossings, and adhering to proper impedance matching guidelines to minimize signal reflections and distortions.

2. Clock Distribution: Implement proper clock distribution networks with low skew and jitter to ensure accurate timing for synchronous operations within 5AGTFD3H3F40I3G.

3. Signal Termination: Use appropriate termination techniques such as series termination resistors or parallel termination to match the transmission line impedance and minimize signal reflections.

Thermal Management:

Effective thermal management is crucial to prevent overheating and ensure the longevity of 5AGTFD3H3F40I3G. Consider the following tips for thermal management:

1. Heat Sink Integration: Integrate heat sinks or thermal pads on 5AGTFD3H3F40I3G and other heat-generating components to enhance heat dissipation and reduce operating temperatures.

2. Airflow Optimization: Design the enclosure or system housing to facilitate proper airflow, ensuring adequate cooling for 5AGTFD3H3F40I3G and associated components.

3. Temperature Monitoring: Implement temperature monitoring circuits or sensors to continuously monitor the operating temperature of 5AGTFD3H3F40I3G and trigger thermal management mechanisms if temperatures exceed safe limits.

Conclusion:

By incorporating effective power management, signal integrity techniques, and thermal management strategies, you can optimize the performance and reliability of 5AGTFD3H3F40I3G in your design projects, ensuring smooth operation and longevity.

5AGTFD3H3F40I3G FAQ

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3. Are the 5AGTFD3H3F40I3G price and inventory displayed accurate?

The price and inventory of 5AGTFD3H3F40I3G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5AGTFD3H3F40I3G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5AGTFD3H3F40I3G we delivered, we will accept the replacement or return of the 5AGTFD3H3F40I3G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5AGTFD3H3F40I3G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations