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Name: 5AGTFC7H3F35I3NAD
Brand: Intel
SKU: 5AGTFC7H3F35I3NAD
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5AGTFC7H3F35I3NAD

Part No.:: 5AGTFC7H3F35I3NAD

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 544 I/O 1152FBGA

In Stock:: 3278

Quantity:: Add To Cart

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5AGTFC7H3F35I3NAD Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria V GT
ProductStatus:
Obsolete
NumberofLABs/CLBs:
11460
NumberofLogicElements/Cells:
242000
TotalRAMBits:
15470592
NumberofI/O:
544
NumberofGates:
-
Voltage-Supply:
1.12V ~ 1.18V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5AGTFC7H3F35I3NAD this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5AGTFC7H3F35I3NAD price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5AGTFC7H3F35I3NAD to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5AGTFC7H3F35I3NAD information

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5AGTFC7H3F35I3NAD Application Introduction

5AGTFC7H3F35I3NAD (5G, AI, IoT, Cloud, 7nm, Heterogeneous Integration, 3D Packaging, 5nm, Advanced Packaging, Data Center) Integration Guidelines for Effective Design

Introduction:

5AGTFC7H3F35I3NAD technologies encompass a broad spectrum of cutting-edge advancements, including 5G connectivity, artificial intelligence, Internet of Things (IoT), cloud computing, advanced semiconductor manufacturing processes, and innovative packaging techniques. Integrating these technologies efficiently into a design project requires careful consideration of various factors such as power management, signal integrity, and thermal management.

Design Optimization Techniques:

1. Power Management:

Effective power management is crucial for 5AGTFC7H3F35I3NAD designs to ensure optimal performance and energy efficiency. Implement power gating techniques to selectively power down unused blocks or components, reducing overall power consumption. Utilize dynamic voltage and frequency scaling (DVFS) algorithms to adjust voltage and frequency levels based on workload demands, further optimizing power usage. Incorporate low-power modes and sleep states to minimize standby power consumption during idle periods.

2. Signal Integrity:

Maintaining signal integrity is essential for reliable data transmission and processing in 5AGTFC7H3F35I3NAD systems. Employ high-speed signal routing techniques such as controlled impedance traces, differential signaling, and signal termination to minimize reflections, crosstalk, and electromagnetic interference (EMI). Implement signal integrity analysis tools to identify and mitigate signal integrity issues early in the design phase. Utilize ground and power planes, as well as proper signal layer stack-up, to reduce noise and ensure signal integrity across the PCB.

3. Thermal Management:

Effective thermal management is critical for preventing overheating and maintaining the reliability of 5AGTFC7H3F35I3NAD components. Utilize thermal analysis tools to model and simulate heat dissipation within the system, identifying hotspots and optimizing thermal pathways. Incorporate passive cooling techniques such as heatsinks, thermal vias, and copper pours to enhance heat dissipation. Implement active cooling solutions like fans or liquid cooling systems for high-power components or densely packed designs. Ensure adequate airflow and ventilation within the enclosure to facilitate heat exchange and maintain operating temperatures within safe limits.

4. Advanced Packaging:

Utilize advanced packaging technologies such as 3D integration and heterogeneous integration to optimize space utilization, reduce interconnect lengths, and improve system performance. Explore advanced packaging techniques like System-in-Package (SiP), Chip-on-Board (CoB), and Fan-Out Wafer-Level Packaging (FoWLP) to achieve higher levels of integration and functionality. Leverage advanced packaging materials and processes to enhance thermal performance, signal integrity, and reliability in 5AGTFC7H3F35I3NAD designs.

5. Design Considerations:

When designing 5AGTFC7H3F35I3NAD systems, consider the following key factors:

- Compatibility: Ensure compatibility and interoperability between different 5AGTFC7H3F35I3NAD technologies and components to facilitate seamless integration and operation.

- Scalability: Design the system with scalability in mind to accommodate future upgrades and expansions, allowing for flexibility and adaptability to evolving requirements.

- Security: Implement robust security measures to protect sensitive data and ensure the integrity and confidentiality of 5AGTFC7H3F35I3NAD systems against cyber threats and vulnerabilities.

- Reliability: Conduct thorough reliability testing and validation to ensure the stability, durability, and longevity of 5AGTFC7H3F35I3NAD designs under various operating conditions and environmental factors.

- Compliance: Adhere to industry standards and regulatory requirements governing 5AGTFC7H3F35I3NAD technologies, ensuring compliance with relevant certifications and certifications.

5AGTFC7H3F35I3NAD FAQ

1. How to order 5AGTFC7H3F35I3NAD on icwhale.com?

Currently, icwhale.com only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

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We have a professional and experienced quality control team to strictly verify and test the 5AGTFC7H3F35I3NAD. All suppliers must pass our qualification reviews before they can publish their products including 5AGTFC7H3F35I3NAD on icwhale.com; we pay more attention to the channels and quality of 5AGTFC7H3F35I3NAD products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the 5AGTFC7H3F35I3NAD price and inventory displayed accurate?

The price and inventory of 5AGTFC7H3F35I3NAD fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5AGTFC7H3F35I3NAD?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5AGTFC7H3F35I3NAD we delivered, we will accept the replacement or return of the 5AGTFC7H3F35I3NAD only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5AGTFC7H3F35I3NAD.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations