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Name: 5AGTFC7H3F35I3NAA
Brand: Intel
SKU: 5AGTFC7H3F35I3NAA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5AGTFC7H3F35I3NAA

Part No.:: 5AGTFC7H3F35I3NAA

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 544 I/O 1152FBGA

In Stock:: 2122

Quantity:: Add To Cart

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5AGTFC7H3F35I3NAA Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria V GT
ProductStatus:
Obsolete
NumberofLABs/CLBs:
11460
NumberofLogicElements/Cells:
242000
TotalRAMBits:
15470592
NumberofI/O:
544
NumberofGates:
-
Voltage-Supply:
1.12V ~ 1.18V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5AGTFC7H3F35I3NAA this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5AGTFC7H3F35I3NAA price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5AGTFC7H3F35I3NAA to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5AGTFC7H3F35I3NAA information

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5AGTFC7H3F35I3NAA Application Introduction

5AGTFC7H3F35I3NAA is a versatile field-programmable gate array (FPGA) known for its high performance and flexibility in various electronic design projects. Utilizing 5AGTFC7H3F35I3NAA effectively requires careful consideration of several design optimization techniques, including power management, signal integrity, and thermal management.

Power Management:

To optimize power consumption when using 5AGTFC7H3F35I3NAA, consider the following strategies:

- Dynamic Power Scaling: Implement dynamic voltage and frequency scaling techniques to adjust power consumption based on the FPGA's workload, allowing for efficient power usage without compromising performance.

- Power Gating: Utilize power gating techniques to selectively power down unused portions of the FPGA, reducing static power consumption during idle or low-power operation modes.

- Clock Gating: Employ clock gating methods to disable clock signals to unused logic blocks or circuits within the FPGA, minimizing power consumption by reducing unnecessary clock toggling.

- Low-Power Modes: Take advantage of low-power operating modes and sleep states available in the FPGA to further reduce power consumption during periods of inactivity or low processing demand.

Signal Integrity:

To ensure reliable signal integrity in 5AGTFC7H3F35I3NAA-based designs, follow these best practices:

- Impedance Matching: Properly match signal traces' impedance to minimize signal reflections and ensure efficient signal transmission across the FPGA and its associated components.

- Signal Termination: Implement termination resistors or other termination techniques to prevent signal reflections and maintain signal integrity, especially for high-speed interfaces and communication protocols.

- Clock Distribution: Use dedicated clock distribution networks with low skew and jitter to maintain synchronous operation and minimize timing uncertainties within the FPGA design.

- Signal Integrity Analysis: Perform signal integrity analysis, including simulation and timing analysis, to identify and mitigate potential signal integrity issues early in the design process.

Thermal Management:

To address thermal challenges associated with 5AGTFC7H3F35I3NAA usage, implement the following thermal management techniques:

- Heat Sink Integration: Integrate heat sinks or thermal pads to dissipate heat generated by the FPGA and prevent temperature buildup within the device, especially in high-performance or densely packed designs.

- Airflow Design: Ensure adequate airflow within the system enclosure to facilitate heat dissipation from the FPGA and surrounding components, reducing the risk of thermal throttling or overheating.

- Temperature Monitoring: Incorporate temperature sensors or thermal monitoring circuitry to continuously monitor the FPGA's temperature and trigger proactive cooling measures if temperature thresholds are exceeded.

- Power Budgeting: Consider power dissipation requirements during the design phase and allocate sufficient thermal budget for cooling solutions to maintain the FPGA's operating temperature within safe limits.

Conclusion:

By implementing effective power management, signal integrity, and thermal management techniques, designers can maximize the performance, reliability, and longevity of 5AGTFC7H3F35I3NAA-based designs across various electronic applications.

5AGTFC7H3F35I3NAA FAQ

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3. Are the 5AGTFC7H3F35I3NAA price and inventory displayed accurate?

The price and inventory of 5AGTFC7H3F35I3NAA fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5AGTFC7H3F35I3NAA?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5AGTFC7H3F35I3NAA we delivered, we will accept the replacement or return of the 5AGTFC7H3F35I3NAA only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5AGTFC7H3F35I3NAA.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations