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Name: 1ST280EY3F55E3VG
Brand: Intel
SKU: 1ST280EY3F55E3VG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 1ST280EY3F55E3VG

Part No.:: 1ST280EY3F55E3VG

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1ST280EY3F55E3VG.pdf

Description:: IC FPGA 296 I/O 2912BGA

In Stock:: 2692

Quantity:: Add To Cart

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1ST280EY3F55E3VG Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 TX
ProductStatus:
Active
NumberofLABs/CLBs:
350000
NumberofLogicElements/Cells:
2800000
TotalRAMBits:
-
NumberofI/O:
296
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1ST280EY3F55E3VG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1ST280EY3F55E3VG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1ST280EY3F55E3VG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1ST280EY3F55E3VG information

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1ST280EY3F55E3VG Application Introduction

1ST280EY3F55E3VG is a high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel. It offers versatile capabilities and is widely used in various electronic design projects, from digital signal processing to high-speed data processing.

Application Scenarios:

In digital communications systems, 1ST280EY3F55E3VG can be utilized for implementing complex signal processing algorithms, such as modulation/demodulation schemes in wireless communication systems or error correction algorithms in data transmission systems.

Circuit Design:

To effectively utilize 1ST280EY3F55E3VG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power consumption. Utilize power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) techniques to minimize power consumption during idle or low-utilization periods. Additionally, utilize low-power modes provided by the FPGA to further reduce power consumption when feasible.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as signal distortion, crosstalk, and jitter. Follow high-speed design guidelines provided by Intel to ensure proper impedance matching, controlled trace lengths, and adequate ground/power plane distribution. Utilize signal conditioning techniques such as termination resistors and equalization circuits to improve signal integrity in high-speed interfaces.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and ensure reliable operation of 1ST280EY3F55E3VG. Utilize proper heatsinking techniques, such as attaching heat sinks or thermal pads to the FPGA package, and ensure adequate airflow within the system enclosure. Monitor the temperature of the FPGA using built-in temperature sensors or external sensors and implement thermal throttling mechanisms to dynamically adjust the FPGA's operating frequency or voltage to prevent overheating.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and accurate clock signals throughout the FPGA design. Use clock synthesis and distribution techniques such as clock buffers, clock dividers, and clock skew optimization to minimize clock skew and jitter. Implement clock domain crossing (CDC) techniques such as synchronizers and handshake protocols to ensure proper data transfer between asynchronous clock domains.

5. Design Verification:

Thoroughly verify the design using simulation tools and hardware-in-the-loop (HIL) testing to ensure the functionality, performance, and reliability of the 1ST280EY3F55E3VG-based system. Perform functional simulation, timing analysis, and power analysis to validate the design against the specified requirements. Conduct comprehensive testing under various operating conditions, including temperature extremes and voltage fluctuations, to ensure robustness and reliability.

Considerations:

When designing with 1ST280EY3F55E3VG, it's essential to consider:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP slices, to maximize performance and minimize resource contention.

- Design Partitioning: Partition the design into smaller modules or hierarchical blocks to facilitate design reuse, improve scalability, and simplify debugging and verification.

- Design Security: Implement security features such as device authentication, bitstream encryption, and tamper detection to protect the intellectual property and sensitive data stored in the FPGA.

- Compliance and Standards: Ensure compliance with industry standards and regulations relevant to your application, such as FCC regulations for electromagnetic interference (EMI) and compatibility (EMC) in electronic devices.

1ST280EY3F55E3VG FAQ

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6. What is the process for return or replacement of 1ST280EY3F55E3VG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1ST280EY3F55E3VG we delivered, we will accept the replacement or return of the 1ST280EY3F55E3VG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1ST280EY3F55E3VG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations