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Name: 1ST280EY2F55I2LG
Brand: Intel
SKU: 1ST280EY2F55I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1ST280EY2F55I2LG

Part No.:: 1ST280EY2F55I2LG

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1ST280EY2F55I2LG.pdf

Description:: IC FPGA 296 I/O 2912BGA

In Stock:: 3950

Quantity:: Add To Cart

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1ST280EY2F55I2LG Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 TX
ProductStatus:
Active
NumberofLABs/CLBs:
350000
NumberofLogicElements/Cells:
2800000
TotalRAMBits:
-
NumberofI/O:
296
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

1ST280EY2F55I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1ST280EY2F55I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1ST280EY2F55I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1ST280EY2F55I2LG information

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1ST280EY2F55I2LG Application Introduction

1ST280EY2F55I2LG is a high-performance FPGA (Field-Programmable Gate Array) chip known for its versatility and flexibility in diverse electronic design projects.

Application Scenario:

In telecommunications infrastructure, 1ST280EY2F55I2LG can be utilized to implement advanced signal processing algorithms for data transmission and reception, enabling higher data rates and improved network performance.

Circuit Design:

To effectively integrate 1ST280EY2F55I2LG into a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to optimize power consumption and ensure stable operation of 1ST280EY2F55I2LG. Utilize voltage regulators and power sequencing circuits to provide clean and stable power supply voltages to the FPGA and associated components.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as reflections, crosstalk, and jitter. Use proper signal termination techniques, controlled impedance traces, and ground planes to maintain signal integrity and maximize the performance of 1ST280EY2F55I2LG.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and maintain the operational reliability of 1ST280EY2F55I2LG. Use thermal vias, heatsinks, and thermal pads to dissipate heat generated by the FPGA and other heat-producing components.

4. Clock Distribution:

Implement a robust clock distribution network to distribute clock signals evenly and accurately to 1ST280EY2F55I2LG and other synchronous components. Use low-jitter clock sources and minimize clock skew to ensure reliable operation of the FPGA-based system.

5. Design for Testability:

Include built-in self-test (BIST) circuitry and debug interfaces to facilitate testing and debugging of 1ST280EY2F55I2LG-based designs. Use boundary scan (JTAG) and other debugging tools to validate the functionality and performance of the FPGA during development and production stages.

Considerations:

When designing with 1ST280EY2F55I2LG, it's essential to consider:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic cells, DSP slices, and memory blocks, to maximize design efficiency and minimize resource constraints.

- Timing Closure: Pay close attention to timing constraints and perform timing analysis to ensure that all timing requirements are met, avoiding timing violations and performance degradation.

- Security: Implement security features such as bitstream encryption, authentication mechanisms, and secure boot to protect the intellectual property and integrity of 1ST280EY2F55I2LG-based designs from unauthorized access and tampering.

- Design Reusability: Design modular and reusable IP cores to facilitate design reuse and accelerate the development of future 1ST280EY2F55I2LG-based projects, reducing time-to-market and development costs.

- Compliance: Ensure compliance with industry standards and regulations, such as FCC regulations for electromagnetic compatibility (EMC) and safety standards, to ensure the reliability and regulatory compliance of 1ST280EY2F55I2LG-based products.

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6. What is the process for return or replacement of 1ST280EY2F55I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1ST280EY2F55I2LG we delivered, we will accept the replacement or return of the 1ST280EY2F55I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1ST280EY2F55I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations