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Name: 1ST250EY1F55I1VG
Brand: Intel
SKU: 1ST250EY1F55I1VG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1ST250EY1F55I1VG

Part No.:: 1ST250EY1F55I1VG

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1ST250EY1F55I1VG.pdf

Description:: IC FPGA 296 I/O 2912BGA

In Stock:: 2381

Quantity:: Add To Cart

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1ST250EY1F55I1VG Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 TX
ProductStatus:
Active
NumberofLABs/CLBs:
312500
NumberofLogicElements/Cells:
2500000
TotalRAMBits:
-
NumberofI/O:
296
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

1ST250EY1F55I1VG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1ST250EY1F55I1VG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1ST250EY1F55I1VG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1ST250EY1F55I1VG information

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1ST250EY1F55I1VG Application Introduction

1ST250EY1F55I1VG is a high-performance FPGA (Field-Programmable Gate Array) with versatile functionality, commonly used in digital design projects for various applications. It features a large number of logic elements, high-speed transceivers, and low power consumption.

Application Scenario:

In telecommunications infrastructure, 1ST250EY1F55I1VG can be employed to implement high-speed data processing and routing functionalities in network equipment, such as routers and switches.

Circuit Design:

To effectively utilize 1ST250EY1F55I1VG in a digital design project, follow these guidelines:

1. Power Management:

Implement robust power supply and management techniques to ensure stable voltage levels for 1ST250EY1F55I1VG and associated circuitry. Utilize dedicated power rails and decoupling capacitors to minimize noise and ensure reliable operation.

2. Signal Integrity:

Design PCB layouts with controlled impedance traces and minimize signal reflections to maintain signal integrity, especially for high-speed transceiver interfaces of 1ST250EY1F55I1VG. Use termination techniques, such as series resistors or parallel termination, to match impedance and reduce signal distortion.

3. Thermal Management:

Ensure effective thermal dissipation for 1ST250EY1F55I1VG to prevent overheating and ensure reliable operation. Incorporate heat sinks, thermal vias, and proper airflow in the enclosure design to dissipate heat generated during operation.

4. Clock Distribution:

Implement robust clock distribution networks to ensure stable and synchronized clock signals for 1ST250EY1F55I1VG and peripheral components. Use clock buffer circuits, PLLs (Phase-Locked Loops), and clock tree synthesis techniques to minimize clock skew and jitter.

5. Design Optimization:

Optimize the FPGA design to efficiently utilize resources and meet performance requirements. Utilize FPGA synthesis tools to minimize logic utilization, reduce routing congestion, and optimize timing constraints for 1ST250EY1F55I1VG.

Considerations:

When designing with 1ST250EY1F55I1VG, it's essential to consider:

- Resource Utilization: Efficiently utilize logic elements, memory blocks, and DSP (Digital Signal Processing) resources to optimize FPGA utilization and minimize cost.

- Timing Closure: Perform timing analysis and optimization to ensure all timing constraints are met, and critical paths are properly optimized for maximum performance.

- Design Verification: Thoroughly verify the design using simulation and emulation techniques to ensure functional correctness and performance compliance with specifications.

- ESD Protection: Implement ESD (Electrostatic Discharge) protection measures to safeguard 1ST250EY1F55I1VG and other sensitive components from damage during handling and operation.

- Compliance Testing: Ensure the design complies with relevant industry standards and regulations, such as FCC (Federal Communications Commission) regulations for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) testing.

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6. What is the process for return or replacement of 1ST250EY1F55I1VG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1ST250EY1F55I1VG we delivered, we will accept the replacement or return of the 1ST250EY1F55I1VG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1ST250EY1F55I1VG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations