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Name: 1SG280HN2F43E2LGS3
Brand: Intel
SKU: 1SG280HN2F43E2LGS3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG280HN2F43E2LGS3

Part No.:: 1SG280HN2F43E2LGS3

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 1SG280HN2F43E2LGS3.pdf

Description:: IC FPGA 688 I/O 1760FBGA

In Stock:: 3342

Quantity:: Add To Cart

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1SG280HN2F43E2LGS3 Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
350000
NumberofLogicElements/Cells:
2800000
TotalRAMBits:
-
NumberofI/O:
688
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG280HN2F43E2LGS3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG280HN2F43E2LGS3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG280HN2F43E2LGS3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG280HN2F43E2LGS3 information

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1SG280HN2F43E2LGS3 Application Introduction

1SG280HN2F43E2LGS3 is a powerful FPGA, widely used in high-performance computing and data processing applications. It features advanced signal processing capabilities, high-speed transceivers, and robust power management features.

Application Scenario:

In data centers, this chip can be employed for accelerating computational tasks, such as data encryption and decryption, which require high throughput and low latency.

Circuit Design:

To effectively utilize 1SG280HN2F43E2LGS3 in your project, consider the following design optimization tips:

1. Power Management:

Efficient power management is crucial for high-performance FPGAs. Implement voltage regulators to provide stable power supply levels and decoupling capacitors to minimize noise. Ensure that the power distribution network is designed to handle the current requirements of the FPGA, with particular attention to the core voltage and I/O banks.

2. Signal Integrity:

High-speed transceivers require careful attention to signal integrity. Use proper PCB layout techniques such as controlled impedance traces, differential pair routing, and minimizing stubs. Additionally, implement signal conditioning techniques like pre-emphasis and equalization to improve the quality of high-speed signals.

3. Thermal Management:

The high processing power of 1SG280HN2F43E2LGS3 generates significant heat, necessitating effective thermal management. Use heat sinks and cooling fans to dissipate heat, and consider using thermal interface materials to improve heat transfer. Monitor the FPGA's temperature using built-in sensors and adjust the cooling mechanisms as needed.

4. Clock Management:

Proper clock management is essential for synchronization and timing accuracy. Use phase-locked loops (PLLs) and clock distribution networks to ensure that clock signals are clean and well-distributed. Pay attention to clock skew and jitter, and implement techniques to mitigate their effects.

5. Power Integrity:

Ensure power integrity by designing a robust power delivery network (PDN). Use low-ESR capacitors and proper grounding techniques to minimize voltage fluctuations and noise. Perform power integrity analysis during the design phase to identify and address potential issues.

Considerations:

When designing with 1SG280HN2F43E2LGS3, it's essential to consider:

- PCB Layout: Optimize the PCB layout for signal and power integrity, paying attention to trace lengths, impedance matching, and via placements.

- Firmware Development: Develop efficient firmware to leverage the FPGA's capabilities, ensuring optimal performance and resource utilization.

- System Testing: Conduct thorough testing to verify the functionality and reliability of the design under various operating conditions.

- Compliance: Ensure that the design complies with relevant standards for electromagnetic compatibility (EMC) and thermal performance.

- Scalability: Design the system with scalability in mind, allowing for future upgrades and enhancements without significant redesign.

1SG280HN2F43E2LGS3 FAQ

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3. Are the 1SG280HN2F43E2LGS3 price and inventory displayed accurate?

The price and inventory of 1SG280HN2F43E2LGS3 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 1SG280HN2F43E2LGS3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG280HN2F43E2LGS3 we delivered, we will accept the replacement or return of the 1SG280HN2F43E2LGS3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG280HN2F43E2LGS3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations