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Name: 1SG280HH3F55E1VGS3
Brand: Intel
SKU: 1SG280HH3F55E1VGS3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 1SG280HH3F55E1VGS3

Part No.:: 1SG280HH3F55E1VGS3

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG280HH3F55E1VGS3.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 3034

Quantity:: Add To Cart

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1SG280HH3F55E1VGS3 Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
350000
NumberofLogicElements/Cells:
2800000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG280HH3F55E1VGS3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG280HH3F55E1VGS3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG280HH3F55E1VGS3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG280HH3F55E1VGS3 information

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1SG280HH3F55E1VGS3 performance and reliability evaluation in extreme environments

1SG280HH3F55E1VGS3 is a high-performance FPGA chip designed to operate reliably in extreme environments, including high temperatures, low temperatures, and high humidity.

Environmental Considerations:

In designing the 1SG280HH3F55E1VGS3, several factors are taken into account to ensure its robust performance under harsh conditions.

High Temperature:

This chip is designed with advanced thermal management techniques. It incorporates high-efficiency heat sinks and thermal vias to dissipate heat effectively. Additionally, the internal architecture is optimized to minimize power consumption, reducing the overall heat generation.

Low Temperature:

The materials and components used in 1SG280HH3F55E1VGS3 are selected for their low-temperature tolerance. The chip's operational parameters are tested extensively at sub-zero temperatures to ensure stable performance. Special attention is given to preventing thermal stress that could lead to mechanical failures.

Humidity:

To combat high humidity, the 1SG280HH3F55E1VGS3 is encapsulated with moisture-resistant materials. Conformal coatings and specialized packaging techniques are used to protect the internal circuitry from moisture ingress, which could otherwise cause corrosion and electrical shorts.

Performance in Real Applications:

In real-world applications, the 1SG280HH3F55E1VGS3 demonstrates exceptional reliability and performance. For instance, in aerospace applications, where both high and low temperatures are common, this chip consistently delivers stable operation without performance degradation. In industrial environments with high humidity, such as chemical plants, the chip's moisture-resistant features ensure long-term reliability.

Conclusion:

The design and testing methodologies applied to the 1SG280HH3F55E1VGS3 make it a robust choice for applications requiring reliable performance in extreme environments. Its ability to handle high temperatures, low temperatures, and humidity ensures that it can be deployed in a wide range of challenging conditions without compromising on functionality or efficiency.

1SG280HH3F55E1VGS3 FAQ

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6. What is the process for return or replacement of 1SG280HH3F55E1VGS3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG280HH3F55E1VGS3 we delivered, we will accept the replacement or return of the 1SG280HH3F55E1VGS3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG280HH3F55E1VGS3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations