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Name: 1SG280HH2F55E2VGS3
Brand: Intel
SKU: 1SG280HH2F55E2VGS3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 1SG280HH2F55E2VGS3

Part No.:: 1SG280HH2F55E2VGS3

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG280HH2F55E2VGS3.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 2948

Quantity:: Add To Cart

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1SG280HH2F55E2VGS3 Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
350000
NumberofLogicElements/Cells:
2800000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG280HH2F55E2VGS3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG280HH2F55E2VGS3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG280HH2F55E2VGS3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG280HH2F55E2VGS3 information

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The application and technological advancement of 1SG280HH2F55E2VGS3 in specific industries

1SG280HH2F55E2VGS3 is an advanced integrated circuit used in various specialized industries, offering high performance and reliability. This FPGA (Field-Programmable Gate Array) is known for its flexibility, scalability, and ability to handle complex tasks efficiently.

Application Scenario:

In telecommunications, this chip is used for data processing and signal modulation in base stations. Its capability to handle large amounts of data and perform complex algorithms in real-time significantly enhances network performance.

Circuit Design:

To design a data processing module for a base station using 1SG280HH2F55E2VGS3, follow these steps:

1. Data Interface Connection:

Connect the data input interfaces, such as high-speed serial transceivers, to the relevant pins of this chip. Ensure proper signal conditioning to handle high data rates and maintain signal integrity.

2. Signal Processing:

Utilize the FPGA's resources to implement complex signal processing algorithms. Configure the logic blocks within 1SG280HH2F55E2VGS3 to perform tasks like error correction, modulation, and demodulation.

3. Memory Integration:

Integrate external memory components, such as DRAM or SRAM, to store large datasets and intermediate processing results. Connect these memory modules to the appropriate memory interface pins on the chip.

4. Output Control:

Design the output stage to interface with the next stage in the base station, such as RF transmitters. Configure the output pins of 1SG280HH2F55E2VGS3 to handle the processed signals and ensure they meet the required specifications.

5. Power Management:

Implement robust power management techniques to provide stable and clean power to 1SG280HH2F55E2VGS3. Use voltage regulators and power distribution networks to minimize noise and power fluctuations.

Considerations:

When designing the circuit, it's essential to consider:

- Signal Integrity: Ensure proper layout techniques to maintain signal integrity at high data rates.

- Thermal Management: Implement adequate cooling solutions, such as heat sinks or fans, to manage the heat generated by the chip.

- Real-Time Performance: Optimize the design to ensure real-time processing capabilities, crucial for telecommunications applications.

- Reliability: Conduct thorough testing to ensure the system can handle various operational conditions without failure.

- Compliance: Ensure the design meets industry standards and regulations for electromagnetic compatibility and safety.

In conclusion, 1SG280HH2F55E2VGS3 plays a vital role in advancing telecommunications technology by enabling efficient data processing and signal modulation. Its integration into base stations helps improve network reliability and performance, setting new industry standards and enhancing technological levels.

1SG280HH2F55E2VGS3 FAQ

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3. Are the 1SG280HH2F55E2VGS3 price and inventory displayed accurate?

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6. What is the process for return or replacement of 1SG280HH2F55E2VGS3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG280HH2F55E2VGS3 we delivered, we will accept the replacement or return of the 1SG280HH2F55E2VGS3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG280HH2F55E2VGS3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations