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Name: 1SG280HH1F55E2LGS3
Brand: Intel
SKU: 1SG280HH1F55E2LGS3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG280HH1F55E2LGS3

Part No.:: 1SG280HH1F55E2LGS3

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG280HH1F55E2LGS3.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 2124

Quantity:: Add To Cart

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1SG280HH1F55E2LGS3 Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
350000
NumberofLogicElements/Cells:
2800000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG280HH1F55E2LGS3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG280HH1F55E2LGS3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG280HH1F55E2LGS3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG280HH1F55E2LGS3 information

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1SG280HH1F55E2LGS3 Application Introduction

1SG280HH1F55E2LGS3 is a high-performance field-programmable gate array (FPGA) widely used in various electronic design projects, offering flexibility and scalability for complex digital systems.

Application Scenario:

In digital signal processing applications, 1SG280HH1F55E2LGS3 can be utilized to implement advanced algorithms for audio and image processing, as well as in telecommunications for signal modulation and demodulation.

Circuit Design:

To effectively integrate 1SG280HH1F55E2LGS3 into a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 1SG280HH1F55E2LGS3. Utilize power gating techniques and dynamic voltage and frequency scaling (DVFS) to optimize power usage based on the system's workload.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and ensure proper signal integrity. Utilize techniques such as impedance matching, signal isolation, and controlled impedance routing to maintain signal integrity and reduce electromagnetic interference (EMI).

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure reliable operation of 1SG280HH1F55E2LGS3 under high computational loads. Utilize heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat efficiently.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and synchronized clock signals throughout the FPGA design. Utilize clock buffers, phase-locked loops (PLLs), and clock tree synthesis techniques to minimize clock skew and jitter.

5. Configuration Management:

Implement secure and reliable configuration management strategies to ensure the integrity and authenticity of the FPGA configuration data. Utilize encryption techniques, such as bitstream encryption and secure boot mechanisms, to protect against unauthorized access and tampering.

Considerations:

When designing with 1SG280HH1F55E2LGS3, it's essential to consider:

- Resource Utilization: Optimize the FPGA resource utilization to maximize design efficiency and minimize resource conflicts.

- Timing Closure: Perform thorough timing analysis and optimization to meet the design's timing constraints and ensure reliable operation at the desired clock frequency.

- Design Debugging: Implement robust debugging features, such as on-chip logic analyzers and debug interfaces, to facilitate the debugging process and expedite design verification.

- Design Security: Incorporate security features, such as cryptographic accelerators and secure communication protocols, to protect sensitive data and intellectual property stored within the FPGA design.

- Design for Testability: Design the FPGA with built-in self-test (BIST) capabilities and test access mechanisms to facilitate comprehensive testing and validation of the design.

1SG280HH1F55E2LGS3 FAQ

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3. Are the 1SG280HH1F55E2LGS3 price and inventory displayed accurate?

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6. What is the process for return or replacement of 1SG280HH1F55E2LGS3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG280HH1F55E2LGS3 we delivered, we will accept the replacement or return of the 1SG280HH1F55E2LGS3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG280HH1F55E2LGS3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations