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Name: 1SG280HH1F55E2LGAS
Brand: Intel
SKU: 1SG280HH1F55E2LGAS
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG280HH1F55E2LGAS

Part No.:: 1SG280HH1F55E2LGAS

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG280HH1F55E2LGAS.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 3143

Quantity:: Add To Cart

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1SG280HH1F55E2LGAS Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
350000
NumberofLogicElements/Cells:
2800000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG280HH1F55E2LGAS this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG280HH1F55E2LGAS price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG280HH1F55E2LGAS to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG280HH1F55E2LGAS information

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1SG280HH1F55E2LGAS Application Introduction

1SG280HH1F55E2LGAS is a versatile FPGA chip offering high performance and flexibility, commonly utilized in a wide range of electronic design projects for various applications.

Application Scenario:

In telecommunications infrastructure, 1SG280HH1F55E2LGAS can be employed to implement signal processing and protocol handling tasks, such as in base station equipment for wireless communication networks.

Circuit Design:

To effectively utilize 1SG280HH1F55E2LGAS in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power usage of 1SG280HH1F55E2LGAS and associated components. Utilize power gating, dynamic voltage and frequency scaling, and low-power design methodologies to minimize power consumption during both active and idle states.

2. Signal Integrity:

Pay careful attention to signal integrity to maintain reliable communication between 1SG280HH1F55E2LGAS and external devices or components. Properly design signal routing, impedance matching, and termination schemes to mitigate signal degradation, reflections, and crosstalk, ensuring accurate data transmission.

3. Thermal Management:

Implement effective thermal management strategies to dissipate heat generated by 1SG280HH1F55E2LGAS and prevent overheating. Utilize heat sinks, thermal vias, and fans to enhance heat dissipation and maintain the operating temperature within safe limits, thereby ensuring reliable performance and longevity of the FPGA chip.

4. Timing Closure:

Ensure timing closure by carefully optimizing the design's timing constraints, clock networks, and critical paths to meet the required performance specifications and achieve maximum operating frequency. Utilize synthesis and place-and-route tools to analyze and optimize the design's timing constraints, addressing setup and hold time violations effectively.

5. Resource Utilization:

Optimize resource utilization by efficiently mapping the design's logic functions onto the available resources within 1SG280HH1F55E2LGAS, such as lookup tables (LUTs), flip-flops, and memory blocks. Utilize synthesis optimization techniques, logic restructuring, and pipelining to minimize resource usage and maximize the FPGA's capacity for accommodating additional functionality or future enhancements.

Considerations:

When designing with 1SG280HH1F55E2LGAS, it's essential to consider:

- Design Constraints: Ensure compliance with design constraints, such as timing, area, and power requirements, to meet performance goals and design specifications.

- Design Validation: Perform thorough design validation and verification through simulation, emulation, and prototyping to identify and address potential issues early in the design cycle, ensuring functional correctness and reliability.

- Design Reusability: Design modular and reusable components to facilitate future design iterations, upgrades, and reuse in other projects, maximizing design efficiency and productivity.

- Design Security: Implement security features and measures, such as encryption, authentication, and secure booting, to protect intellectual property (IP) and prevent unauthorized access or tampering with the design's firmware or configuration data.

- Design Documentation: Maintain comprehensive design documentation, including design specifications, block diagrams, schematics, and design constraints, to facilitate collaboration, troubleshooting, and future maintenance of the design project.

1SG280HH1F55E2LGAS FAQ

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3. Are the 1SG280HH1F55E2LGAS price and inventory displayed accurate?

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6. What is the process for return or replacement of 1SG280HH1F55E2LGAS?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG280HH1F55E2LGAS we delivered, we will accept the replacement or return of the 1SG280HH1F55E2LGAS only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG280HH1F55E2LGAS.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations