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Name: 1SG280HH1F55E1VGS3
Brand: Intel
SKU: 1SG280HH1F55E1VGS3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 1SG280HH1F55E1VGS3

Part No.:: 1SG280HH1F55E1VGS3

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG280HH1F55E1VGS3.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 3085

Quantity:: Add To Cart

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1SG280HH1F55E1VGS3 Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
350000
NumberofLogicElements/Cells:
2800000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG280HH1F55E1VGS3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG280HH1F55E1VGS3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG280HH1F55E1VGS3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG280HH1F55E1VGS3 information

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1SG280HH1F55E1VGS3 Application Introduction

1SG280HH1F55E1VGS3 is a high-performance FPGA (Field Programmable Gate Array) chip commonly used in a variety of electronic design projects for its versatility and processing power.

Application Scenario:

In digital signal processing applications, 1SG280HH1F55E1VGS3 can be utilized to implement complex algorithms for audio and image processing, as well as communications systems.

Circuit Design:

To maximize the potential of 1SG280HH1F55E1VGS3 in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management circuitry to ensure stable voltage levels for 1SG280HH1F55E1VGS3 and associated peripherals. Utilize low-dropout voltage regulators and decoupling capacitors to minimize noise and ensure reliable operation.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and ensure signal integrity. Use proper routing techniques, ground planes, and signal isolation to maintain the quality of signals interacting with 1SG280HH1F55E1VGS3.

3. Thermal Management:

Implement effective thermal management strategies to dissipate heat generated by 1SG280HH1F55E1VGS3 during operation. Use heat sinks, thermal vias, and proper airflow to prevent overheating and ensure long-term reliability.

4. Clock Distribution:

Design a robust clock distribution network to provide stable clock signals to 1SG280HH1F55E1VGS3 and synchronize its internal operations with external devices. Use clock buffers, phase-locked loops (PLLs), and careful routing to minimize clock skew and jitter.

5. System Integration:

Integrate 1SG280HH1F55E1VGS3 seamlessly into the overall system architecture, considering compatibility with other components and interfaces. Ensure proper communication protocols, such as SPI or I2C, are utilized for efficient data exchange.

Considerations:

When optimizing the design with 1SG280HH1F55E1VGS3, keep in mind:

- Resource Utilization: Efficiently utilize the FPGA resources, such as logic cells and memory blocks, to optimize performance and minimize resource wastage.

- Design Validation: Perform thorough testing and verification of the design to ensure functionality, reliability, and compliance with specifications.

- Firmware Development: Develop optimized firmware and logic designs tailored to the capabilities and constraints of 1SG280HH1F55E1VGS3 for optimal system performance.

- Environmental Conditions: Consider operating conditions, such as temperature and humidity, and design the system to withstand and operate reliably in harsh environments.

- Security Considerations: Implement security features and protocols to protect the integrity and confidentiality of data processed by 1SG280HH1F55E1VGS3 against potential threats and vulnerabilities.

1SG280HH1F55E1VGS3 FAQ

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3. Are the 1SG280HH1F55E1VGS3 price and inventory displayed accurate?

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6. What is the process for return or replacement of 1SG280HH1F55E1VGS3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG280HH1F55E1VGS3 we delivered, we will accept the replacement or return of the 1SG280HH1F55E1VGS3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG280HH1F55E1VGS3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations