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Name: 1SG250LU3F50I3XG
Brand: Intel
SKU: 1SG250LU3F50I3XG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG250LU3F50I3XG

Part No.:: 1SG250LU3F50I3XG

Manufacturer:: Intel

Package:: 2397-BBGA, FCBGA

Datasheet:: 1SG250LU3F50I3XG.pdf

Description:: IC FPGA 704 I/O 2397BGA

In Stock:: 2742

Quantity:: Add To Cart

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1SG250LU3F50I3XG Specifications

Package/Case:
2397-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
312500
NumberofLogicElements/Cells:
2500000
TotalRAMBits:
-
NumberofI/O:
704
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

1SG250LU3F50I3XG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG250LU3F50I3XG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG250LU3F50I3XG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG250LU3F50I3XG information

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1SG250LU3F50I3XG Application Introduction

1SG250LU3F50I3XG is a high-performance FPGA (Field-Programmable Gate Array) chip with advanced features, commonly used in various digital design projects for its flexibility and scalability.

Application Scenario:

In digital signal processing applications, 1SG250LU3F50I3XG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively use 1SG250LU3F50I3XG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power usage and minimize power wastage. Utilize power gating and dynamic voltage scaling to adjust power consumption based on the FPGA's workload and operational requirements.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing the PCB layout and routing high-speed signals appropriately. Use impedance matching techniques and signal termination to minimize signal reflections and ensure reliable data transmission.

3. Thermal Management:

Prevent overheating of 1SG250LU3F50I3XG by implementing effective thermal management strategies. Use heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat generated during operation and maintain optimal operating temperatures.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and synchronized clock signals throughout the FPGA design. Use low-skew clock routing techniques and clock buffering to minimize clock skew and ensure reliable timing performance.

5. Design Partitioning:

Partition the FPGA design into smaller, manageable modules to facilitate easier development, debugging, and maintenance. Use hierarchical design techniques to organize the design hierarchy and optimize resource utilization within the FPGA.

Considerations:

When designing with 1SG250LU3F50I3XG, keep the following considerations in mind:

- Resource Utilization: Optimize FPGA resource utilization to maximize performance and minimize resource wastage.

- Timing Closure: Ensure timing closure by carefully analyzing timing constraints and optimizing the design for reliable operation within the specified clock frequencies.

- Design Constraints: Consider design constraints such as pin assignments, I/O standards, and package limitations to ensure compatibility and interoperability with other components in the system.

- Functional Verification: Thoroughly test and verify the FPGA design to ensure correct functionality and identify any potential issues or bugs early in the development process.

- Scalability: Design the FPGA project with scalability in mind to accommodate future expansion or upgrades without requiring significant redesign or reconfiguration.

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3. Are the 1SG250LU3F50I3XG price and inventory displayed accurate?

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6. What is the process for return or replacement of 1SG250LU3F50I3XG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG250LU3F50I3XG we delivered, we will accept the replacement or return of the 1SG250LU3F50I3XG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG250LU3F50I3XG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations