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Name: 1SG250HH3F55I2VG
Brand: Intel
SKU: 1SG250HH3F55I2VG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG250HH3F55I2VG

Part No.:: 1SG250HH3F55I2VG

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG250HH3F55I2VG.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 2800

Quantity:: Add To Cart

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1SG250HH3F55I2VG Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
312500
NumberofLogicElements/Cells:
2500000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

1SG250HH3F55I2VG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG250HH3F55I2VG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG250HH3F55I2VG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG250HH3F55I2VG information

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1SG250HH3F55I2VG Application Introduction

1SG250HH3F55I2VG is a high-performance FPGA (Field-Programmable Gate Array) widely used in various electronic design projects for its versatility and scalability.

Application Scenario:

In digital signal processing applications, 1SG250HH3F55I2VG can be utilized to implement complex algorithms for tasks such as image processing or audio signal analysis.

Circuit Design:

To effectively integrate 1SG250HH3F55I2VG into your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management strategies to ensure stable voltage levels for 1SG250HH3F55I2VG and associated components. Utilize voltage regulators and decoupling capacitors to minimize voltage fluctuations and ensure reliable operation.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal crosstalk and interference. Proper grounding and signal routing techniques should be employed to maintain signal integrity and prevent performance degradation.

3. Thermal Management:

Ensure adequate heat dissipation for 1SG250HH3F55I2VG to prevent overheating and maintain optimal performance. Use heat sinks, thermal vias, and fans as necessary to dissipate heat efficiently and prolong the lifespan of the FPGA.

4. Clock Distribution:

Implement a robust clock distribution network to ensure accurate and synchronized timing for all components, including 1SG250HH3F55I2VG. Proper termination and impedance matching techniques should be employed to minimize clock skew and jitter.

5. I/O Optimization:

Optimize the I/O configuration of 1SG250HH3F55I2VG to maximize data throughput and minimize latency. Utilize high-speed serializers and deserializers (SERDES) for high-speed data interfaces and implement parallel interfaces where applicable to enhance data processing efficiency.

Considerations:

When designing with 1SG250HH3F55I2VG, it's important to consider:

- Resource Utilization: Efficiently utilize the FPGA resources, including logic cells, memory blocks, and DSP slices, to optimize performance and minimize resource constraints.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met and that the design operates reliably at the desired clock frequency.

- Design Verification: Conduct comprehensive functional verification and simulation to validate the design's functionality and performance before implementation on the actual hardware.

- Design Reusability: Design the FPGA logic in a modular and scalable manner to facilitate design reuse and enable easy integration into future projects or iterations.

- Documentation: Maintain detailed documentation of the design architecture, constraints, and implementation details to aid in troubleshooting, debugging, and future modifications.

1SG250HH3F55I2VG FAQ

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3. Are the 1SG250HH3F55I2VG price and inventory displayed accurate?

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6. What is the process for return or replacement of 1SG250HH3F55I2VG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG250HH3F55I2VG we delivered, we will accept the replacement or return of the 1SG250HH3F55I2VG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG250HH3F55I2VG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations