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Name: 1SG250HH3F55E3VG
Brand: Intel
SKU: 1SG250HH3F55E3VG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG250HH3F55E3VG

Part No.:: 1SG250HH3F55E3VG

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG250HH3F55E3VG.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 2427

Quantity:: Add To Cart

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1SG250HH3F55E3VG Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
312500
NumberofLogicElements/Cells:
2500000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG250HH3F55E3VG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG250HH3F55E3VG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG250HH3F55E3VG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG250HH3F55E3VG information

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1SG250HH3F55E3VG Application Introduction

1SG250HH3F55E3VG is a high-performance FPGA (Field-Programmable Gate Array) chip offering versatile capabilities for various design projects, ranging from telecommunications to industrial automation.

Application Scenario:

In a telecommunications project, 1SG250HH3F55E3VG can be utilized to implement advanced signal processing algorithms for efficient data transmission and reception.

Circuit Design:

To effectively integrate 1SG250HH3F55E3VG into your design project, consider the following optimization techniques:

1. Power Management:

Implement a robust power management system to ensure stable and clean power supply to 1SG250HH3F55E3VG and associated components. Utilize high-quality voltage regulators and decoupling capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure signal integrity. Utilize impedance matching techniques and proper termination schemes for high-speed signal traces connected to 1SG250HH3F55E3VG.

3. Thermal Management:

Implement an effective thermal management solution to dissipate heat generated by 1SG250HH3F55E3VG during operation. Use heat sinks, thermal vias, and proper airflow design to prevent overheating and ensure reliable performance.

4. Clock Distribution:

Design a robust clock distribution network to ensure precise and stable clock signals to 1SG250HH3F55E3VG and synchronized operation of all internal components. Minimize clock skew and jitter by optimizing trace routing and using clock buffer ICs if necessary.

5. I/O Interface:

Optimize the I/O interface design to maximize data transfer rates and minimize latency. Utilize high-speed serial interfaces, such as PCIe or Gigabit Ethernet, for fast and efficient communication with external devices or network interfaces.

Considerations:

When designing with 1SG250HH3F55E3VG, it's essential to consider:

- Resource Utilization: Efficiently utilize the FPGA resources, such as logic cells and DSP blocks, to optimize performance and minimize resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met and avoid timing violations.

- Design Verification: Conduct extensive simulation and testing to verify the functionality, performance, and reliability of the design under various operating conditions.

- Security: Implement security features, such as encryption and authentication, to protect sensitive data and prevent unauthorized access to the FPGA configuration.

- Documentation: Maintain comprehensive documentation throughout the design process to facilitate future debugging, maintenance, and design revisions.

1SG250HH3F55E3VG FAQ

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3. Are the 1SG250HH3F55E3VG price and inventory displayed accurate?

The price and inventory of 1SG250HH3F55E3VG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 1SG250HH3F55E3VG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG250HH3F55E3VG we delivered, we will accept the replacement or return of the 1SG250HH3F55E3VG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG250HH3F55E3VG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations