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Name: 1SG250HH3F55E2VG
Brand: Intel
SKU: 1SG250HH3F55E2VG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG250HH3F55E2VG

Part No.:: 1SG250HH3F55E2VG

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG250HH3F55E2VG.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 3611

Quantity:: Add To Cart

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1SG250HH3F55E2VG Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
312500
NumberofLogicElements/Cells:
2500000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG250HH3F55E2VG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG250HH3F55E2VG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG250HH3F55E2VG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG250HH3F55E2VG information

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1SG250HH3F55E2VG Application Introduction

1SG250HH3F55E2VG is a highly efficient FPGA (Field-Programmable Gate Array) device designed for a wide range of applications, offering high performance and flexibility in system design.

Application Scenario:

In telecommunications infrastructure, 1SG250HH3F55E2VG can be utilized for signal processing and protocol handling in base stations and network equipment, enabling high-speed data transmission and reliable communication.

Circuit Design:

To harness the capabilities of 1SG250HH3F55E2VG effectively, consider the following design optimization techniques:

1. Power Management:

Implement efficient power supply solutions to ensure stable voltage and current levels for 1SG250HH3F55E2VG and associated components. Utilize voltage regulators and power distribution networks to minimize voltage droops and transient fluctuations.

2. Signal Integrity:

Design PCB layouts with proper signal integrity techniques to minimize signal degradation and timing issues. Pay attention to impedance matching, routing lengths, and layer stack-up to maintain signal integrity, especially for high-speed interfaces connected to 1SG250HH3F55E2VG.

3. Thermal Management:

Implement effective thermal solutions, such as heat sinks, thermal vias, and fans, to dissipate heat generated by 1SG250HH3F55E2VG and prevent overheating. Ensure adequate airflow and heat dissipation paths within the system enclosure to maintain optimal operating temperatures.

4. Clock Distribution:

Design a robust clock distribution network to provide clean and stable clock signals to 1SG250HH3F55E2VG and synchronize various components within the system. Use dedicated clock buffers and low-jitter oscillators to minimize clock skew and ensure reliable timing operation.

5. Configuration Management:

Implement secure and reliable configuration mechanisms for 1SG250HH3F55E2VG to facilitate easy firmware updates and configuration changes. Utilize non-volatile memory solutions or external configuration interfaces, such as JTAG or SPI, for flexible device programming and reconfiguration.

Considerations:

When optimizing the design with 1SG250HH3F55E2VG, it's essential to consider:

- System Scalability: Design the system architecture to accommodate future expansion and scalability requirements, leveraging the reconfigurability of 1SG250HH3F55E2VG for evolving application needs.

- Environmental Conditions: Consider the operating environment and environmental factors, such as temperature, humidity, and vibration, when designing the system enclosure and selecting components for long-term reliability.

- Compliance and Standards: Ensure compliance with industry standards and regulatory requirements, such as FCC regulations for electromagnetic compatibility (EMC) and safety standards, to facilitate product certification and market acceptance.

- System Security: Implement robust security measures, such as encryption algorithms and secure boot mechanisms, to protect sensitive data and prevent unauthorized access to 1SG250HH3F55E2VG and system resources.

- Design Validation: Conduct thorough testing and validation of the system design to verify functionality, performance, and reliability under various operating conditions, ensuring a robust and dependable solution.

1SG250HH3F55E2VG FAQ

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3. Are the 1SG250HH3F55E2VG price and inventory displayed accurate?

The price and inventory of 1SG250HH3F55E2VG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 1SG250HH3F55E2VG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG250HH3F55E2VG we delivered, we will accept the replacement or return of the 1SG250HH3F55E2VG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG250HH3F55E2VG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations