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Name: 1SG250HH2F55I2LG
Brand: Intel
SKU: 1SG250HH2F55I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG250HH2F55I2LG

Part No.:: 1SG250HH2F55I2LG

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG250HH2F55I2LG.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 3749

Quantity:: Add To Cart

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1SG250HH2F55I2LG Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
312500
NumberofLogicElements/Cells:
2500000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

1SG250HH2F55I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG250HH2F55I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG250HH2F55I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG250HH2F55I2LG information

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1SG250HH2F55I2LG Application Introduction

1SG250HH2F55I2LG is a high-performance FPGA chip widely used in complex digital systems for various applications. It features advanced logic elements, high-speed transceivers, and efficient power management capabilities.

Application Scenario:

In telecommunications, this chip can be utilized for data processing and signal transmission tasks, enhancing the performance and reliability of communication systems.

Circuit Design:

To design an efficient communication system using 1SG250HH2F55I2LG, follow these steps:

1. Power Management:

Ensure a stable and noise-free power supply for the chip. Utilize low-dropout (LDO) regulators and switching regulators to provide different voltage levels. Incorporate decoupling capacitors close to the power pins of this chip to filter out high-frequency noise and ensure stable operation.

2. Signal Integrity:

Maintain signal integrity by carefully designing the PCB layout. Use differential pairs for high-speed signals and ensure proper termination. Minimize crosstalk and electromagnetic interference (EMI) by maintaining adequate spacing between signal traces and using ground planes.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating. Use heat sinks and thermal vias to dissipate heat from this chip. Ensure adequate airflow in the system by incorporating fans or placing the chip in a well-ventilated area of the enclosure.

4. Input/Output Interfaces:

Connect the relevant input and output devices to the appropriate pins of 1SG250HH2F55I2LG. Use appropriate level shifters if the I/O voltage levels of the connected devices differ from the chip's voltage levels. Ensure proper impedance matching for high-speed interfaces to prevent signal reflection and loss.

5. Configuration and Programming:

Configure the FPGA using the appropriate programming tools and software. Implement efficient algorithms to optimize the performance and resource utilization of 1SG250HH2F55I2LG. Test the design thoroughly to ensure functionality and performance meet the required specifications.

Considerations:

When designing the system, consider the following aspects:

- Power Sequencing: Ensure proper power-up and power-down sequencing to avoid damaging the chip.

- Signal Quality: Monitor signal quality using oscilloscopes and logic analyzers to identify and mitigate issues related to signal integrity.

- Thermal Constraints: Continuously monitor the temperature of the chip during operation and ensure that it stays within the recommended range.

- Firmware Optimization: Optimize the firmware for performance and efficiency to fully utilize the capabilities of 1SG250HH2F55I2LG.

- Compliance: Ensure the design complies with relevant industry standards and regulations for electromagnetic compatibility (EMC) and safety.

1SG250HH2F55I2LG FAQ

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3. Are the 1SG250HH2F55I2LG price and inventory displayed accurate?

The price and inventory of 1SG250HH2F55I2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 1SG250HH2F55I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG250HH2F55I2LG we delivered, we will accept the replacement or return of the 1SG250HH2F55I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG250HH2F55I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations