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Name: 1SG250HH2F55E1VG
Brand: Intel
SKU: 1SG250HH2F55E1VG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG250HH2F55E1VG

Part No.:: 1SG250HH2F55E1VG

Manufacturer:: Intel

Package:: 2912-BBGA, FCBGA

Datasheet:: 1SG250HH2F55E1VG.pdf

Description:: IC FPGA 1160 I/O 2912BGA

In Stock:: 3241

Quantity:: Add To Cart

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1SG250HH2F55E1VG Specifications

Package/Case:
2912-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
312500
NumberofLogicElements/Cells:
2500000
TotalRAMBits:
-
NumberofI/O:
1160
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG250HH2F55E1VG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG250HH2F55E1VG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG250HH2F55E1VG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG250HH2F55E1VG information

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1SG250HH2F55E1VG Application Introduction

1SG250HH2F55E1VG is a high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering versatility and flexibility for a wide range of applications.

Application Scenario:

In the realm of digital signal processing, 1SG250HH2F55E1VG can be utilized to implement complex algorithms for audio and video processing, communication systems, and real-time data analysis.

Circuit Design:

To optimize the design utilizing 1SG250HH2F55E1VG, consider the following techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable operation of 1SG250HH2F55E1VG and associated components. Utilize voltage regulators, filtering capacitors, and proper grounding techniques to minimize noise and ensure reliable performance.

2. Signal Integrity:

Design the PCB layout to minimize signal distortion and ensure signal integrity. Pay attention to signal routing, impedance matching, and minimizing signal reflections to maintain high-speed data transmission and prevent data errors.

3. Thermal Management:

Implement effective thermal management strategies to dissipate heat generated by 1SG250HH2F55E1VG and prevent overheating. Utilize thermal vias, heatsinks, and proper airflow within the enclosure to maintain optimal operating temperatures and prolong the lifespan of the device.

4. Clock Distribution:

Optimize clock distribution within the FPGA design to ensure synchronous operation and minimize clock skew. Use dedicated clock networks, clock buffers, and phase-locked loops (PLLs) to generate stable clock signals and synchronize various components within the system.

5. Resource Utilization:

Maximize the utilization of FPGA resources, including logic elements, memory blocks, and DSP slices, to efficiently implement the desired functionality. Utilize advanced synthesis and optimization techniques to minimize resource usage and improve overall system performance.

Considerations:

When designing with 1SG250HH2F55E1VG, it's crucial to consider:

- Design Constraints: Understand the limitations and constraints of the FPGA device, including maximum clock frequency, resource availability, and I/O capabilities.

- Timing Analysis: Perform comprehensive timing analysis to ensure that the design meets timing requirements and operates reliably under all conditions.

- Design Validation: Thoroughly test the FPGA design using simulation tools and hardware validation platforms to verify functionality, performance, and reliability before deployment.

- Security: Implement appropriate security measures, such as encryption, authentication, and secure boot mechanisms, to protect the FPGA design from unauthorized access and tampering.

- Future Scalability: Design the system with scalability in mind to accommodate future upgrades or expansions, such as additional functionality or increased processing capacity, without requiring a complete redesign.

1SG250HH2F55E1VG FAQ

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3. Are the 1SG250HH2F55E1VG price and inventory displayed accurate?

The price and inventory of 1SG250HH2F55E1VG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 1SG250HH2F55E1VG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG250HH2F55E1VG we delivered, we will accept the replacement or return of the 1SG250HH2F55E1VG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG250HH2F55E1VG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations