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Name: 1SG211HN3F43E2VG
Brand: Intel
SKU: 1SG211HN3F43E2VG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG211HN3F43E2VG

Part No.:: 1SG211HN3F43E2VG

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 1SG211HN3F43E2VG.pdf

Description:: IC FPGA 688 I/O 1760FBGA

In Stock:: 2152

Quantity:: Add To Cart

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1SG211HN3F43E2VG Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
263750
NumberofLogicElements/Cells:
2110000
TotalRAMBits:
-
NumberofI/O:
688
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG211HN3F43E2VG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG211HN3F43E2VG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG211HN3F43E2VG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG211HN3F43E2VG information

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1SG211HN3F43E2VG Application Introduction

1SG211HN3F43E2VG is a highly versatile FPGA chip that can be effectively utilized in various design projects, offering flexibility and performance for a wide range of applications.

Application Scenario:

In the field of digital signal processing, 1SG211HN3F43E2VG can be applied to implement complex algorithms for tasks such as image processing, audio signal processing, and communications systems.

Circuit Design:

To optimize the design using 1SG211HN3F43E2VG, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to ensure stable voltage levels for 1SG211HN3F43E2VG and associated components. Utilize voltage regulators, capacitors, and proper grounding techniques to minimize noise and ensure reliable operation.

2. Signal Integrity:

Pay attention to signal integrity by carefully designing PCB layouts, minimizing signal reflections, and ensuring proper termination techniques. Utilize impedance matching and signal conditioning circuitry to maintain signal integrity, especially in high-speed data transmission applications.

3. Thermal Management:

To manage heat dissipation effectively, incorporate thermal vias, heat sinks, and proper airflow in the PCB design. Ensure adequate spacing between components to prevent thermal coupling and thermal hotspots, which can degrade performance and reliability.

4. Clock Distribution:

Design a robust clock distribution network to ensure synchronous operation and minimize clock skew. Use PLLs (Phase-Locked Loops) and clock buffers to generate and distribute clock signals efficiently, maintaining timing integrity and reducing jitter.

5. I/O Planning:

Optimize I/O planning by carefully selecting the appropriate I/O standards and voltage levels to interface with external devices. Consider signal voltage levels, signal termination, and I/O standards compatibility to ensure reliable communication and interfacing.

Considerations:

When designing with 1SG211HN3F43E2VG, keep in mind the following considerations:

- Resource Utilization: Efficiently utilize the available FPGA resources, including logic cells, DSP blocks, and memory resources, to maximize design performance and minimize resource wastage.

- Design Constraints: Consider design constraints such as timing requirements, area constraints, and power budgets to ensure that the design meets performance targets and operates within specified constraints.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototyping to identify and address any design issues or bugs before fabrication. Perform functional testing and validation to ensure the design meets functional requirements and specifications.

- Design Documentation: Maintain comprehensive documentation of the design, including design specifications, schematics, PCB layouts, and firmware/software source code, to facilitate design review, debugging, and future maintenance.

- Design Iteration: Iterate on the design through incremental improvements and optimizations to refine the design and enhance performance, reliability, and manufacturability.

1SG211HN3F43E2VG FAQ

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3. Are the 1SG211HN3F43E2VG price and inventory displayed accurate?

The price and inventory of 1SG211HN3F43E2VG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 1SG211HN3F43E2VG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG211HN3F43E2VG we delivered, we will accept the replacement or return of the 1SG211HN3F43E2VG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG211HN3F43E2VG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations