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Name: 1SG211HN2F43E2LG
Brand: Intel
SKU: 1SG211HN2F43E2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG211HN2F43E2LG

Part No.:: 1SG211HN2F43E2LG

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 1SG211HN2F43E2LG.pdf

Description:: IC FPGA 688 I/O 1760FBGA

In Stock:: 3176

Quantity:: Add To Cart

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1SG211HN2F43E2LG Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
263750
NumberofLogicElements/Cells:
2110000
TotalRAMBits:
-
NumberofI/O:
688
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG211HN2F43E2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG211HN2F43E2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG211HN2F43E2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG211HN2F43E2LG information

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1SG211HN2F43E2LG Application Introduction

1SG211HN2F43E2LG is a highly integrated FPGA (Field-Programmable Gate Array) with advanced features, ideal for a wide range of applications in electronics design.

Application Scenario:

In digital signal processing applications, 1SG211HN2F43E2LG can be utilized to implement complex algorithms for image processing or audio filtering in real-time systems.

Circuit Design:

To effectively use 1SG211HN2F43E2LG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal power usage of 1SG211HN2F43E2LG and associated components. Utilize low-power modes when the device is idle and employ dynamic voltage scaling techniques to adapt power consumption based on workload.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure proper signal integrity. Pay special attention to high-speed signal traces and use impedance-matched routing techniques to reduce reflections and signal distortion.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 1SG211HN2F43E2LG during operation. Utilize heatsinks, thermal vias, and proper airflow in the enclosure to maintain the device within the recommended operating temperature range.

4. Clock Distribution:

Optimize the clock distribution network to ensure stable and accurate clock signals reach 1SG211HN2F43E2LG and peripheral devices. Minimize clock skew and jitter by using low-phase noise oscillators and proper clock routing techniques.

5. I/O Planning:

Carefully plan the placement and routing of input/output (I/O) signals to 1SG211HN2F43E2LG to minimize signal crosstalk and interference. Utilize differential signaling and proper termination techniques to improve signal integrity and reduce electromagnetic interference (EMI).

Considerations:

When designing with 1SG211HN2F43E2LG, keep the following considerations in mind:

- Design Validation: Perform thorough simulations and prototyping to validate the design before fabrication to ensure functionality and performance meet the requirements.

- Firmware Optimization: Optimize firmware algorithms to maximize resource utilization and minimize latency, ensuring efficient operation of 1SG211HN2F43E2LG in the target application.

- Environmental Conditions: Consider the operating environment and ensure the design can withstand temperature variations, humidity, and other environmental factors for reliable long-term operation.

- Compliance Standards: Design the system to comply with relevant industry standards and certifications, such as FCC for electromagnetic compatibility (EMC) and safety standards, to facilitate market acceptance.

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3. Are the 1SG211HN2F43E2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 1SG211HN2F43E2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG211HN2F43E2LG we delivered, we will accept the replacement or return of the 1SG211HN2F43E2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG211HN2F43E2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations