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Name: 1SG210HU1F50E2VGAS
Brand: Intel
SKU: 1SG210HU1F50E2VGAS
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 1SG210HU1F50E2VGAS

Part No.:: 1SG210HU1F50E2VGAS

Manufacturer:: Intel

Package:: 2397-BBGA, FCBGA

Datasheet:: 1SG210HU1F50E2VGAS.pdf

Description:: IC FPGA 704 I/O 2397BGA

In Stock:: 3767

Quantity:: Add To Cart

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1SG210HU1F50E2VGAS Specifications

Package/Case:
2397-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
262500
NumberofLogicElements/Cells:
2100000
TotalRAMBits:
-
NumberofI/O:
704
NumberofGates:
-
Voltage-Supply:
0.77V ~ 0.97V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

1SG210HU1F50E2VGAS this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 1SG210HU1F50E2VGAS price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 1SG210HU1F50E2VGAS to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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1SG210HU1F50E2VGAS information

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1SG210HU1F50E2VGAS Application Introduction

1SG210HU1F50E2VGAS is a powerful FPGA chip that is highly suitable for complex and demanding design projects, offering advanced features for high-performance computing and data processing.

Design Optimization Tips:

To effectively use 1SG210HU1F50E2VGAS in your design projects, consider the following optimization techniques:

1. Power Management:

Implementing efficient power management is crucial for maintaining the performance and longevity of this chip. Use low-dropout regulators (LDOs) and switching regulators to provide stable power supplies. Implement power gating techniques to turn off unused logic blocks and reduce power consumption. Additionally, ensure that the power distribution network (PDN) is properly designed to minimize voltage drops and noise.

2. Signal Integrity:

Maintaining signal integrity is essential for high-speed data transfer and reliable operation. Use controlled impedance traces and differential signaling for high-speed data lines. Minimize the length of high-speed traces and avoid sharp bends to reduce signal reflections and crosstalk. Implement proper termination techniques, such as series or parallel termination, to match the characteristic impedance of the transmission line.

3. Thermal Management:

Effective thermal management ensures the chip operates within safe temperature limits, preventing overheating and ensuring reliability. Use heatsinks, thermal vias, and proper airflow management to dissipate heat effectively. Consider using thermal interface materials (TIMs) to enhance heat transfer between the chip and the heatsink. Monitor the temperature of the chip using on-chip temperature sensors and implement dynamic thermal management techniques to adjust the operating frequency and voltage based on thermal conditions.

4. PCB Layout:

A well-designed PCB layout is critical for the performance and reliability of 1SG210HU1F50E2VGAS. Ensure that the power and ground planes are solid and provide a low-impedance path for current flow. Place decoupling capacitors close to the power pins of the chip to filter out high-frequency noise. Route high-speed signals on inner layers between ground planes to shield them from external noise and reduce electromagnetic interference (EMI).

5. Testing and Validation:

Thorough testing and validation are necessary to ensure that the design meets all performance and reliability requirements. Use simulation tools to model the power, thermal, and signal integrity aspects of the design. Conduct comprehensive testing, including functional verification, performance benchmarking, and stress testing under different operating conditions. Implement design for testability (DFT) features to facilitate easy testing and debugging of the final product.

By following these design optimization tips, you can effectively leverage the capabilities of 1SG210HU1F50E2VGAS in your projects, ensuring high performance, reliability, and efficiency.

1SG210HU1F50E2VGAS FAQ

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3. Are the 1SG210HU1F50E2VGAS price and inventory displayed accurate?

The price and inventory of 1SG210HU1F50E2VGAS fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 1SG210HU1F50E2VGAS?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 1SG210HU1F50E2VGAS we delivered, we will accept the replacement or return of the 1SG210HU1F50E2VGAS only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 1SG210HU1F50E2VGAS.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations