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Name: 10M50DAF672C6GES
Brand: Intel
SKU: 10M50DAF672C6GES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10M50DAF672C6GES

Part No.:: 10M50DAF672C6GES

Manufacturer:: Intel

Package:: 672-BGA

Datasheet:: 10M50DAF672C6GES.pdf

Description:: IC FPGA 500 I/O 672FBGA

In Stock:: 3772

Quantity:: Add To Cart

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10M50DAF672C6GES Specifications

Package/Case:
672-BGA
Packaging:
Tray
Series:
MAX® 10
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
3125
NumberofLogicElements/Cells:
50000
TotalRAMBits:
1677312
NumberofI/O:
500
NumberofGates:
-
Voltage-Supply:
1.15V ~ 1.25V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

10M50DAF672C6GES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10M50DAF672C6GES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10M50DAF672C6GES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10M50DAF672C6GES information

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10M50DAF672C6GES Application Introduction

10M50DAF672C6GES is a field-programmable gate array (FPGA) with advanced features suitable for a wide range of applications, from telecommunications to industrial automation. It offers high logic density, flexible I/O options, and efficient power management capabilities.

Application Scenario:

In a digital signal processing application, 10M50DAF672C6GES can be utilized to implement complex algorithms for real-time data processing, such as audio or image processing in multimedia systems.

Circuit Design:

To effectively use 10M50DAF672C6GES in a digital signal processing project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 10M50DAF672C6GES. Utilize low-dropout voltage regulators and power gating techniques to dynamically control power to different FPGA regions based on activity levels.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and electromagnetic interference. Use proper termination techniques, impedance matching, and signal routing guidelines to maintain signal integrity and ensure robust communication between 10M50DAF672C6GES and external devices.

3. Thermal Management:

Ensure adequate thermal dissipation for 10M50DAF672C6GES to prevent overheating and ensure reliable performance. Place thermal vias strategically to enhance heat dissipation from the FPGA package and use heatsinks or thermal pads for effective heat transfer to the surrounding environment.

4. Clock Distribution:

Design a stable and low-jitter clock distribution network to provide synchronized clock signals to 10M50DAF672C6GES and peripheral components. Use clock buffer chips, differential signaling, and proper termination to maintain signal integrity and minimize clock skew.

5. Design for Testability:

Include built-in self-test (BIST) features and debug interfaces in the FPGA design to facilitate testing and debugging during development and production phases. Utilize boundary scan testing and on-chip diagnostic resources to identify and troubleshoot potential hardware faults quickly.

Considerations:

When optimizing the design for 10M50DAF672C6GES, it's essential to consider:

- Resource Utilization: Optimize logic and routing utilization to maximize the efficiency of 10M50DAF672C6GES resources and minimize resource contention.

- Timing Closure: Ensure timing closure by carefully analyzing timing constraints, critical paths, and timing margins to meet design performance requirements.

- Design Reusability: Modularize the design to promote reusability of IP cores and simplify future design iterations or system upgrades.

- Security: Implement security features, such as bitstream encryption and authentication mechanisms, to protect the FPGA configuration and prevent unauthorized access or tampering.

- Compliance: Ensure compliance with industry standards and regulations, such as FCC regulations for electromagnetic compatibility (EMC) and safety standards for reliable operation in various environments.

10M50DAF672C6GES FAQ

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3. Are the 10M50DAF672C6GES price and inventory displayed accurate?

The price and inventory of 10M50DAF672C6GES fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 10M50DAF672C6GES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10M50DAF672C6GES we delivered, we will accept the replacement or return of the 10M50DAF672C6GES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10M50DAF672C6GES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations