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Name: 10M50DAF256C6GES
Brand: Intel
SKU: 10M50DAF256C6GES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10M50DAF256C6GES

Part No.:: 10M50DAF256C6GES

Manufacturer:: Intel

Package:: 256-LBGA

Datasheet:: 10M50DAF256C6GES.pdf

Description:: IC FPGA 178 I/O 256FBGA

In Stock:: 3925

Quantity:: Add To Cart

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10M50DAF256C6GES Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
MAX® 10
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
3125
NumberofLogicElements/Cells:
50000
TotalRAMBits:
1677312
NumberofI/O:
178
NumberofGates:
-
Voltage-Supply:
1.15V ~ 1.25V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

10M50DAF256C6GES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10M50DAF256C6GES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10M50DAF256C6GES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10M50DAF256C6GES information

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10M50DAF256C6GES Application Introduction

10M50DAF256C6GES is a versatile FPGA (Field-Programmable Gate Array) device commonly used in a wide range of digital design projects due to its high performance and flexibility.

Application Scenario:

In digital signal processing applications, 10M50DAF256C6GES can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 10M50DAF256C6GES in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal power consumption. Utilize advanced power-saving features available in 10M50DAF256C6GES to minimize energy usage during both active and idle states.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and electromagnetic interference. Follow best practices for high-speed digital design, such as proper termination techniques and controlled impedance routing, to maintain signal integrity.

3. Thermal Management:

Ensure effective thermal dissipation to prevent overheating and ensure reliable operation of 10M50DAF256C6GES. Use proper heat sinking techniques, thermal vias, and thermal analysis tools during the PCB layout phase to optimize heat dissipation.

4. Clock Distribution:

Implement a robust clock distribution network to ensure accurate and stable clock signals throughout the FPGA design. Use dedicated clock routing resources and minimize clock skew to maintain timing integrity and avoid timing violations.

5. I/O Planning:

Optimize I/O placement and routing to minimize signal delays and maximize I/O performance. Group related I/O interfaces together and utilize differential signaling where necessary to improve noise immunity and signal integrity.

Considerations:

When designing with 10M50DAF256C6GES, keep the following considerations in mind:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic cells and memory blocks, to optimize design performance and minimize resource wastage.

- Design Constraints: Adhere to timing, power, and size constraints specified by the target application and FPGA device. Utilize design optimization tools and techniques to meet these constraints effectively.

- Testability: Design the FPGA system with built-in test features, such as boundary scan testing and built-in self-test (BIST) capabilities, to facilitate easier debugging and verification during development and production phases.

- Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and integrity of the FPGA design against unauthorized access and tampering.

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3. Are the 10M50DAF256C6GES price and inventory displayed accurate?

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6. What is the process for return or replacement of 10M50DAF256C6GES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10M50DAF256C6GES we delivered, we will accept the replacement or return of the 10M50DAF256C6GES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10M50DAF256C6GES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations