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Name: 10M40DAF672I6G
Brand: Intel
SKU: 10M40DAF672I6G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10M40DAF672I6G

Part No.:: 10M40DAF672I6G

Manufacturer:: Intel

Package:: 672-BGA

Datasheet:: 10M40DAF672I6G.pdf

Description:: IC FPGA 500 I/O 672FBGA

In Stock:: 3745

Quantity:: Add To Cart

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10M40DAF672I6G Specifications

Package/Case:
672-BGA
Packaging:
Tray
Series:
MAX® 10
ProductStatus:
Active
NumberofLABs/CLBs:
2500
NumberofLogicElements/Cells:
40000
TotalRAMBits:
1290240
NumberofI/O:
500
NumberofGates:
-
Voltage-Supply:
1.15V ~ 1.25V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10M40DAF672I6G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10M40DAF672I6G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10M40DAF672I6G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10M40DAF672I6G information

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10M40DAF672I6G Application Introduction

10M40DAF672I6G is a field-programmable gate array (FPGA) device manufactured by Microchip Technology. It offers high-density logic and memory resources, making it suitable for a wide range of applications in the fields of telecommunications, industrial automation, and automotive electronics.

Application Scenario:

In the field of telecommunications, 10M40DAF672I6G can be utilized to implement complex signal processing algorithms, such as error correction coding and modulation/demodulation schemes, in wireless communication systems.

Circuit Design:

To effectively utilize 10M40DAF672I6G in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 10M40DAF672I6G and associated circuitry. Utilize power gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS) where applicable to optimize power usage.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as crosstalk, reflection, and electromagnetic interference (EMI). Use proper signal termination techniques, controlled impedance traces, and adequate ground and power plane arrangements to maintain signal integrity and reliability.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and maintain reliable operation of 10M40DAF672I6G. Utilize heat sinks, thermal vias, and proper airflow design to dissipate heat generated during operation. Perform thermal analysis and simulation to identify and mitigate hotspots in the design.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter, ensuring reliable operation of synchronous circuits within 10M40DAF672I6G. Use low-skew clock distribution networks, proper clock routing guidelines, and clock tree synthesis tools to achieve precise timing requirements.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate design reuse, testing, and debugging. Utilize hierarchical design methodologies, IP core integration, and modularization techniques to improve design scalability and maintainability.

Considerations:

When optimizing the design using 10M40DAF672I6G, it's essential to consider:

- Resource Utilization: Optimize resource utilization to maximize the efficiency of 10M40DAF672I6G and minimize area usage.

- Timing Closure: Ensure timing closure by meeting setup and hold time constraints for all critical paths within the design.

- Design Constraints: Consider design constraints such as maximum operating frequency, I/O timing requirements, and device-specific limitations during the design process.

- Verification and Testing: Perform thorough verification and testing to validate the functionality, performance, and reliability of the design under various operating conditions.

- Design Documentation: Maintain comprehensive design documentation, including design specifications, block diagrams, and timing analysis reports, to facilitate collaboration and future design iterations.

10M40DAF672I6G FAQ

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3. Are the 10M40DAF672I6G price and inventory displayed accurate?

The price and inventory of 10M40DAF672I6G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10M40DAF672I6G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10M40DAF672I6G we delivered, we will accept the replacement or return of the 10M40DAF672I6G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10M40DAF672I6G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations