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Name: 10M25SAE144C8G
Brand: Intel
SKU: 10M25SAE144C8G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10M25SAE144C8G

Part No.:: 10M25SAE144C8G

Manufacturer:: Intel

Package:: 144-LQFP Exposed Pad

Datasheet:: 10M25SAE144C8G.pdf

Description:: IC FPGA 101 I/O 144EQFP

In Stock:: 3432

Quantity:: Add To Cart

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10M25SAE144C8G Specifications

Package/Case:
144-LQFP Exposed Pad
Packaging:
Tray
Series:
MAX® 10
ProductStatus:
Active
NumberofLABs/CLBs:
1563
NumberofLogicElements/Cells:
25000
TotalRAMBits:
691200
NumberofI/O:
101
NumberofGates:
-
Voltage-Supply:
2.85V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

10M25SAE144C8G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10M25SAE144C8G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10M25SAE144C8G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10M25SAE144C8G information

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The application and technological advancement of 10M25SAE144C8G in specific industries

10M25SAE144C8G is a field-programmable gate array (FPGA) chip manufactured by Intel (formerly Altera), offering high-performance programmable logic capabilities suitable for a wide range of applications in industries such as telecommunications, aerospace, automotive, and medical devices.

Application Scenario:

In the telecommunications industry, 10M25SAE144C8G plays a crucial role in the development of advanced networking equipment, including routers, switches, and base stations.

Circuit Design:

To integrate 10M25SAE144C8G into a telecommunications system, the following steps can be taken:

1. Protocol Processing:

Utilize the FPGA's programmable logic to implement protocol processing functions such as packet parsing, routing, and quality of service (QoS) management. This enables the efficient handling of network traffic and ensures smooth communication between devices.

2. Interface Support:

Implement various interface protocols such as Ethernet, PCIe, or Interlaken using the configurable I/O resources available in 10M25SAE144C8G. These interfaces facilitate connectivity with external devices and network components.

3. Signal Processing:

Utilize the FPGA's DSP blocks and high-speed transceivers for signal processing tasks such as modulation/demodulation, error correction coding, and channel equalization. This enables the implementation of advanced communication techniques for enhanced performance and reliability.

4. Security Features:

Integrate hardware-accelerated cryptographic algorithms and security protocols into the FPGA design to ensure data confidentiality, integrity, and authenticity in telecommunications networks. This helps protect sensitive information and prevent unauthorized access.

5. System Integration:

Combine the FPGA with other components such as microprocessors, memory modules, and peripheral interfaces to create a complete telecommunications system. Ensure proper system-level design and verification to meet performance, power, and reliability requirements.

Considerations:

When designing with 10M25SAE144C8G, it's essential to consider:

- Resource Utilization: Optimize the FPGA resource usage to maximize performance and minimize resource conflicts.

- Timing Constraints: Ensure that timing constraints are met to guarantee proper operation of the design under different operating conditions and environmental factors.

- Power Consumption: Implement power-saving techniques such as clock gating, power gating, and dynamic voltage scaling to minimize the overall power consumption of the telecommunications system.

- Thermal Management: Address thermal challenges associated with high-density FPGA designs by incorporating proper heat dissipation mechanisms such as heat sinks, fans, and thermal vias.

- Compliance and Certification: Verify compliance with industry standards and regulatory requirements for telecommunications equipment, including electromagnetic compatibility (EMC) and safety certifications.

10M25SAE144C8G FAQ

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3. Are the 10M25SAE144C8G price and inventory displayed accurate?

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6. What is the process for return or replacement of 10M25SAE144C8G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10M25SAE144C8G we delivered, we will accept the replacement or return of the 10M25SAE144C8G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10M25SAE144C8G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations