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Name: 10M16DCU324I6G
Brand: Intel
SKU: 10M16DCU324I6G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10M16DCU324I6G

Part No.:: 10M16DCU324I6G

Manufacturer:: Intel

Package:: 324-LFBGA

Datasheet:: 10M16DCU324I6G.pdf

Description:: IC FPGA 246 I/O 324UBGA

In Stock:: 2886

Quantity:: Add To Cart

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10M16DCU324I6G Specifications

Package/Case:
324-LFBGA
Packaging:
Tray
Series:
MAX® 10
ProductStatus:
Active
NumberofLABs/CLBs:
1000
NumberofLogicElements/Cells:
16000
TotalRAMBits:
562176
NumberofI/O:
246
NumberofGates:
-
Voltage-Supply:
1.15V ~ 1.25V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10M16DCU324I6G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10M16DCU324I6G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10M16DCU324I6G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10M16DCU324I6G information

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10M16DCU324I6G Application Introduction

10M16DCU324I6G is a FPGA chip known for its high performance and versatility, commonly used in various digital design projects. It features a large number of logic elements, embedded memory blocks, and numerous I/O options.

Application Scenario:

In digital signal processing applications, 10M16DCU324I6G can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 10M16DCU324I6G in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal power utilization in the design. Utilize power gating techniques and dynamic voltage and frequency scaling to minimize power consumption during both active and idle states of the FPGA.

2. Signal Integrity:

Pay attention to signal integrity issues to maintain reliable communication between the FPGA and external devices. Utilize proper termination techniques, impedance matching, and signal routing guidelines to minimize signal reflections and crosstalk.

3. Thermal Management:

Ensure effective thermal management to prevent overheating of the 10M16DCU324I6G FPGA. Utilize proper heatsinking, thermal vias, and airflow management techniques to dissipate heat generated during operation and maintain optimal temperature levels.

4. Clock Distribution:

Optimize the clock distribution network to ensure reliable and stable clock signals throughout the FPGA design. Implement proper clock tree synthesis techniques, clock skew optimization, and clock domain crossing strategies to minimize timing violations and ensure synchronous operation.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate easier debugging, testing, and maintenance. Utilize hierarchical design methodologies and IP core integration to promote modularity and reusability in the FPGA design.

Considerations:

When optimizing the FPGA design, it's essential to consider:

- Resource Utilization: Efficiently utilize the available logic elements, memory blocks, and I/O resources to maximize the functionality of the 10M16DCU324I6G FPGA.

- Timing Closure: Perform timing analysis and optimization to ensure that all timing constraints are met and critical paths are properly optimized for performance.

- Design Security: Implement security measures, such as bitstream encryption and device authentication, to protect the intellectual property and integrity of the FPGA design.

- Design Verification: Thoroughly verify the FPGA design through simulation, emulation, and prototyping to identify and eliminate design errors and ensure correct functionality.

- Future Scalability: Design the FPGA system with scalability in mind to accommodate future expansion and upgrades without requiring significant redesign effort.

10M16DCU324I6G FAQ

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3. Are the 10M16DCU324I6G price and inventory displayed accurate?

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6. What is the process for return or replacement of 10M16DCU324I6G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10M16DCU324I6G we delivered, we will accept the replacement or return of the 10M16DCU324I6G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10M16DCU324I6G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations