10CX105YF672E6G

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Intel 10CX105YF672E6G

HIGH-RELIABILITY-COMPONENTS
Part No.:
10CX105YF672E6G
Manufacturer:
Intel
Package:
672-BBGA, FCBGA
Datasheet:
10CX105YF672E6G.pdf
Description:
IC FPGA 236 I/O 672FBGA
In Stock:
2585
Quantity:
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    10CX105YF672E6G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10CX105YF672E6G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10CX105YF672E6G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    10CX105YF672E6G information10CX105YF672E6G information

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    10CX105YF672E6G Typical application Circuitry


    The 10CX105YF672E6G is a model from the Intel® Cyclone® 10 GX FPGA series, designed for high-performance and low-power applications requiring efficient logic, signal processing, and system integration capabilities. Cyclone® 10 GX FPGAs are optimized for a broad range of uses, including but not limited to, automotive, industrial automation, pro AV, and data center acceleration, where their ability to handle high-speed transceiver data rates and their integration features stand out. This specific model encapsulates a rich feature set, including flexible logic elements, high-speed DSP blocks, and integrated transceivers, making it a versatile choice for designers aiming to develop advanced digital systems.

    1. Operating Voltage: The 10CX105YF672E6G operates across a variety of voltage levels for different sections of the FPGA, including core, transceiver, and I/O voltages. The core typically requires a voltage of around 0.9V, while I/O banks may operate at voltages from 1.2V to 3.3V, depending on the specific requirements of the application. Transceiver blocks may require a separate supply voltage, often at 0.9V or 1.2V, to support high-speed data transmission. Ensuring that each power domain is adequately supplied with its respective voltage is crucial for the FPGA's operation and performance.

    2. Pin Configuration and Connectivity: The 10CX105YF672E6G is packaged in a 672-pin FineLine BGA with a dense array of pins allocated for power supplies, ground connections, I/O lines, and high-speed transceiver connections. Power supply pins must be connected to the appropriate voltage sources, with careful attention to the power integrity and decoupling strategies to minimize noise and ensure stable operation. Ground pins should be connected to a robust ground plane. I/O pins are configurable and can be connected to various peripherals and interfaces, depending on the application's needs. High-speed transceiver pins are designated for differential signaling and must be matched with appropriate impedance traces for optimal performance.

    3. Circuit Integration Guidelines: When integrating the 10CX105YF672E6G into a circuit, it's essential to develop a power distribution network that can deliver clean, stable power to each of the FPGA's power domains. To filter out high-frequency noise, decoupling capacitors should be positioned near to the power pins of the FPGA. I/O pins should be carefully configured to match the voltage levels and logic standards of the connected devices, ensuring signal integrity and compatibility. For high-speed transceiver applications, impedance-controlled PCB traces and proper termination are necessary to achieve the desired data rates while minimizing signal distortion and reflections.

    4. Protection and Reliability: Implementing adequate power sequencing for the different voltage domains of the 10CX105YF672E6G is critical for protecting the FPGA from potential damage. Overvoltage and electrostatic discharge (ESD) protection mechanisms for I/O pins can further enhance the FPGA's reliability, especially in environments prone to electrical disturbances. Thermal management solutions, including heatsinks or airflow provisions, may be required to dissipate heat generated by the FPGA during operation, maintaining the device within its specified temperature range.

    5. Application Scenarios: The 10CX105YF672E6G is adept at handling complex digital processing tasks in applications ranging from video processing and machine vision to high-speed communication and digital signal processing. Its high integration capabilities allow for the consolidation of multiple functions within a single device, reducing system complexity and improving performance.

    The 10CX105YF672E6G from the Intel® Cyclone® 10 GX series embodies the cutting-edge of FPGA technology, offering a blend of performance, power efficiency, and integration capabilities. By following detailed circuit integration guidelines and leveraging the FPGA's advanced features, designers can unlock the full potential of this device in a wide array of high-performance applications, driving innovation in digital systems design.

    10CX105YF672E6G FAQ

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    3. Are the 10CX105YF672E6G price and inventory displayed accurate?

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    6. What is the process for return or replacement of 10CX105YF672E6G?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10CX105YF672E6G we delivered, we will accept the replacement or return of the 10CX105YF672E6G only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of 10CX105YF672E6G.

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    (1)Inform us within 90 days

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