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Name: 10AX115U4F45I3SGES
Brand: Intel
SKU: 10AX115U4F45I3SGES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 10AX115U4F45I3SGES

Part No.:: 10AX115U4F45I3SGES

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115U4F45I3SGES.pdf

Description:: IC FPGA 480 I/O 1932FBGA

In Stock:: 3484

Quantity:: Add To Cart

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10AX115U4F45I3SGES Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
480
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115U4F45I3SGES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115U4F45I3SGES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115U4F45I3SGES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115U4F45I3SGES information

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10AX115U4F45I3SGES Application Introduction

10AX115U4F45I3SGES is a field-programmable gate array (FPGA) chip known for its high performance and versatility in a wide range of applications, including telecommunications, industrial automation, and aerospace.

Application Scenario:

In telecommunications infrastructure, 10AX115U4F45I3SGES can be utilized for signal processing, encryption, and data routing tasks in high-speed network equipment.

Circuit Design:

To optimize the design with 10AX115U4F45I3SGES, consider the following aspects:

1. Power Management:

Implement efficient power management techniques to ensure optimal performance and minimal power consumption of 10AX115U4F45I3SGES and associated components. Utilize low-dropout voltage regulators and power gating strategies to minimize power wastage.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and impedance mismatches, ensuring robust signal integrity. Utilize differential signaling, impedance matching techniques, and proper termination schemes to maintain signal quality.

3. Thermal Management:

Ensure effective thermal dissipation to prevent overheating of 10AX115U4F45I3SGES and ensure reliable operation under varying environmental conditions. Incorporate thermal vias, heatsinks, or thermal pads to dissipate heat efficiently from the FPGA and surrounding components.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and accurate clock signals to 10AX115U4F45I3SGES and synchronize various components within the system. Minimize clock skew, jitter, and noise to ensure reliable operation of synchronous circuits.

5. Configuration Management:

Implement secure and reliable configuration management mechanisms to program and reconfigure 10AX115U4F45I3SGES during system initialization or runtime. Utilize encrypted configuration bitstreams, secure boot mechanisms, and error detection/correction techniques to protect against configuration errors and unauthorized access.

Considerations:

When optimizing the design with 10AX115U4F45I3SGES, it's essential to consider:

- Resource Utilization: Efficiently utilize the FPGA resources, such as logic cells, memory blocks, and DSP slices, to maximize performance and minimize resource wastage.

- Timing Constraints: Analyze and meet timing constraints to ensure proper operation of synchronous circuits and avoid timing violations that could lead to functional errors or performance degradation.

- Design Iteration: Iteratively optimize the design through simulation, synthesis, and physical implementation stages to achieve the desired performance, reliability, and manufacturability goals.

- Testability: Design built-in self-test (BIST) structures and debug features to facilitate testing, diagnosis, and debugging of the FPGA-based system during development and deployment phases.

- Standards Compliance: Ensure compliance with industry standards and regulations, such as JEDEC, IEEE, and ISO, to guarantee interoperability, reliability, and safety of the FPGA-based system in various application domains.

10AX115U4F45I3SGES FAQ

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3. Are the 10AX115U4F45I3SGES price and inventory displayed accurate?

The price and inventory of 10AX115U4F45I3SGES fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115U4F45I3SGES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115U4F45I3SGES we delivered, we will accept the replacement or return of the 10AX115U4F45I3SGES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115U4F45I3SGES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations