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Name: 10AX115U3F45I2SGES
Brand: Intel
SKU: 10AX115U3F45I2SGES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115U3F45I2SGES

Part No.:: 10AX115U3F45I2SGES

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115U3F45I2SGES.pdf

Description:: IC FPGA 480 I/O 1932FBGA

In Stock:: 3224

Quantity:: Add To Cart

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10AX115U3F45I2SGES Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
480
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115U3F45I2SGES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115U3F45I2SGES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115U3F45I2SGES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115U3F45I2SGES information

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10AX115U3F45I2SGES Application Introduction

10AX115U3F45I2SGES is a versatile FPGA chip designed for high-performance applications, offering a wide range of features and functionalities.

Application Scenario:

In digital signal processing and communications, 10AX115U3F45I2SGES can be utilized to implement complex algorithms and protocols, such as digital filters, encryption/decryption, and signal modulation/demodulation.

Circuit Design:

To effectively use 10AX115U3F45I2SGES in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of power resources within the FPGA. Utilize power gating, dynamic voltage and frequency scaling (DVFS), and clock gating to minimize power consumption during idle or low-utilization periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as reflections, crosstalk, and electromagnetic interference (EMI). Use proper routing techniques, impedance matching, and ground/power plane separation to maintain signal integrity and reduce noise.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX115U3F45I2SGES to prevent overheating and ensure reliable operation. Utilize heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat effectively and maintain the FPGA's temperature within safe limits.

4. Clock Distribution:

Optimize clock distribution within the FPGA design to minimize clock skew and jitter. Use clock tree synthesis tools to generate balanced clock trees and ensure synchronous operation of all FPGA components.

5. Resource Utilization:

Maximize resource utilization within the FPGA by optimizing logic synthesis, placement, and routing. Utilize advanced synthesis directives, such as retiming and technology mapping, to minimize logic duplication and maximize performance.

Considerations:

When designing with 10AX115U3F45I2SGES, it's essential to consider:

- Design Constraints: Understand the limitations and constraints of the FPGA, such as maximum frequency, resource utilization, and I/O capabilities, to ensure the design meets the required specifications.

- Design Validation: Perform thorough simulations and verification tests to validate the functionality, performance, and reliability of the FPGA design under various operating conditions and corner cases.

- Design Iteration: Iterate the design process iteratively, refining and optimizing the design based on feedback from simulations, prototyping, and testing to achieve the desired performance and functionality.

- Documentation: Maintain comprehensive documentation of the FPGA design, including design specifications, constraints, test plans, and validation results, to facilitate collaboration and future maintenance.

- Compliance: Ensure the FPGA design complies with relevant industry standards and regulations, such as FCC for electromagnetic compatibility (EMC) and safety standards, to ensure interoperability and regulatory compliance.

10AX115U3F45I2SGES FAQ

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3. Are the 10AX115U3F45I2SGES price and inventory displayed accurate?

The price and inventory of 10AX115U3F45I2SGES fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115U3F45I2SGES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115U3F45I2SGES we delivered, we will accept the replacement or return of the 10AX115U3F45I2SGES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115U3F45I2SGES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations