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Name: 10AX115U3F45I2SG
Brand: Intel
SKU: 10AX115U3F45I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115U3F45I2SG

Part No.:: 10AX115U3F45I2SG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115U3F45I2SG.pdf

Description:: IC FPGA 480 I/O 1932FCBGA

In Stock:: 3606

Quantity:: Add To Cart

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10AX115U3F45I2SG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
480
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115U3F45I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115U3F45I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115U3F45I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115U3F45I2SG information

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10AX115U3F45I2SG Application Introduction

10AX115U3F45I2SG is a field-programmable gate array (FPGA) known for its high-performance capabilities and versatility in various electronic design projects.

Application Scenario:

In a digital signal processing project, 10AX115U3F45I2SG can be utilized to implement complex algorithms for audio or image processing applications.

Circuit Design:

To effectively utilize 10AX115U3F45I2SG in a digital signal processing project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure stable voltage levels for 10AX115U3F45I2SG and other components. Utilize voltage regulators and power monitoring circuits to optimize power consumption and prolong battery life if applicable.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and electromagnetic interference. Use impedance matching techniques and proper termination resistors to maintain signal integrity and ensure reliable data transmission.

3. Thermal Management:

To prevent overheating and ensure reliable operation, incorporate thermal management techniques such as heat sinks, thermal vias, and airflow optimization in the FPGA's vicinity. Monitor temperature levels regularly and implement thermal shutdown mechanisms if necessary to prevent damage due to excessive heat.

4. Clock Distribution:

Optimize clock distribution within the FPGA design to minimize clock skew and jitter. Use clock buffers, phase-locked loops (PLLs), and proper routing strategies to ensure synchronous operation and accurate timing across the entire system.

5. Design for Testability:

Include built-in self-test (BIST) features and debug interfaces in the FPGA design to facilitate testing and troubleshooting during the development phase. Implement boundary scan testing and on-chip instrumentation to verify the functionality and performance of the FPGA design efficiently.

Considerations:

When designing with 10AX115U3F45I2SG, it's essential to consider:

- Resource Utilization: Optimize resource utilization within the FPGA to maximize performance and minimize resource conflicts.

- Timing Constraints: Analyze timing constraints and perform timing closure to ensure proper operation and meet timing requirements for critical paths within the design.

- Security: Implement security features such as bitstream encryption and authentication to protect intellectual property and prevent unauthorized access or tampering with the FPGA configuration.

- Design Iteration: Iterate the design process through simulation, synthesis, and verification stages to refine the FPGA design and achieve the desired functionality and performance goals.

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6. What is the process for return or replacement of 10AX115U3F45I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115U3F45I2SG we delivered, we will accept the replacement or return of the 10AX115U3F45I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115U3F45I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations