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Name: 10AX115U3F45I2LG
Brand: Intel
SKU: 10AX115U3F45I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115U3F45I2LG

Part No.:: 10AX115U3F45I2LG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115U3F45I2LG.pdf

Description:: IC FPGA 480 I/O 1932FCBGA

In Stock:: 2411

Quantity:: Add To Cart

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10AX115U3F45I2LG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
480
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115U3F45I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115U3F45I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115U3F45I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115U3F45I2LG information

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10AX115U3F45I2LG Application Introduction

10AX115U3F45I2LG is a field-programmable gate array (FPGA) chip known for its high performance and versatility, commonly used in a wide range of electronic applications, from telecommunications to industrial automation.

Application Scenario:

In the field of telecommunications, 10AX115U3F45I2LG can be utilized for signal processing tasks, such as encoding and decoding algorithms in wireless communication systems.

Circuit Design:

To effectively utilize 10AX115U3F45I2LG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of power resources on the 10AX115U3F45I2LG chip. Utilize low-power modes when possible and employ power gating strategies to selectively power down unused sections of the FPGA.

2. Signal Integrity:

Pay careful attention to signal integrity throughout the design process. Proper PCB layout techniques, such as impedance matching and signal routing guidelines, should be followed to minimize signal distortion and ensure reliable communication between components connected to 10AX115U3F45I2LG.

3. Thermal Management:

Ensure effective thermal management to prevent overheating of the 10AX115U3F45I2LG chip, which can degrade performance and reliability. Use thermal vias, heat sinks, and proper airflow within the enclosure to dissipate heat generated during operation.

4. Clock Distribution:

Optimize clock distribution within the FPGA design to minimize clock skew and ensure synchronous operation of various components. Proper clock tree synthesis techniques should be employed to achieve high-speed and reliable operation.

5. Design Partitioning:

Break down the design into manageable partitions to facilitate modular design and ease of debugging. Utilize hierarchical design methodologies to organize the logic within the 10AX115U3F45I2LG chip efficiently, enhancing design scalability and maintainability.

Considerations:

When optimizing the design using 10AX115U3F45I2LG, it's essential to consider:

- Resource Utilization: Maximize the utilization of available resources on the FPGA chip while minimizing resource conflicts and bottlenecks.

- Timing Closure: Perform thorough timing analysis and closure to ensure that all timing constraints are met, preventing timing violations that can lead to functional errors.

- Design Verification: Implement comprehensive design verification methodologies, including simulation and emulation, to validate the functionality and performance of the design before deployment.

- Security: Incorporate security features, such as bitstream encryption and secure boot mechanisms, to protect the intellectual property and prevent unauthorized access to the FPGA design.

- Lifecycle Management: Plan for long-term lifecycle management of the design by considering factors such as component obsolescence and technology migration paths to ensure the longevity and sustainability of the deployed system.

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3. Are the 10AX115U3F45I2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115U3F45I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115U3F45I2LG we delivered, we will accept the replacement or return of the 10AX115U3F45I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115U3F45I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations