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Name: 10AX115S3F45I2SGE2
Brand: Intel
SKU: 10AX115S3F45I2SGE2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115S3F45I2SGE2

Part No.:: 10AX115S3F45I2SGE2

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115S3F45I2SGE2.pdf

Description:: IC FPGA 624 I/O 1932FBGA

In Stock:: 2363

Quantity:: Add To Cart

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10AX115S3F45I2SGE2 Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115S3F45I2SGE2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115S3F45I2SGE2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115S3F45I2SGE2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115S3F45I2SGE2 information

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10AX115S3F45I2SGE2 Application Introduction

10AX115S3F45I2SGE2 is a field-programmable gate array (FPGA) known for its high performance and versatility, widely used in various electronic design projects, especially those requiring complex logic and signal processing capabilities.

Application Scenario:

In digital signal processing applications, 10AX115S3F45I2SGE2 can be utilized to implement advanced algorithms for tasks such as image processing, audio filtering, and encryption.

Circuit Design:

To effectively utilize 10AX115S3F45I2SGE2 in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 10AX115S3F45I2SGE2 and associated components. Use low-dropout voltage regulators and power gating techniques to optimize power distribution.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion and crosstalk. Use proper termination techniques, impedance matching, and controlled impedance traces to maintain signal integrity and reduce electromagnetic interference.

3. Thermal Management:

Ensure adequate heat dissipation for 10AX115S3F45I2SGE2 to prevent overheating and ensure reliable operation. Incorporate heatsinks, thermal vias, and proper airflow within the enclosure to dissipate heat efficiently.

4. Clock Distribution:

Optimize clock distribution to synchronize various components and maximize system performance. Use clock buffer chips, phase-locked loops (PLLs), and clock tree synthesis techniques to minimize clock skew and jitter.

5. I/O Optimization:

Maximize the utilization of I/O resources on 10AX115S3F45I2SGE2 by carefully planning and mapping I/O interfaces. Group related I/O signals together and utilize high-speed transceivers for interfacing with external devices or communication interfaces.

Considerations:

When designing with 10AX115S3F45I2SGE2, keep in mind the following considerations:

- Resource Utilization: Optimize FPGA resource usage by carefully designing and implementing logic functions to minimize resource wastage.

- Timing Closure: Perform timing analysis and optimization to ensure that the design meets timing requirements and achieves maximum operating frequency.

- Design Reusability: Modularize the design to facilitate reusability and scalability for future projects or design iterations.

- Debugging and Testing: Implement built-in self-test (BIST) features and debug interfaces to facilitate design verification and debugging during development.

- Security: Incorporate security features, such as encryption and authentication, to protect sensitive data and intellectual property stored within the FPGA.

10AX115S3F45I2SGE2 FAQ

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3. Are the 10AX115S3F45I2SGE2 price and inventory displayed accurate?

The price and inventory of 10AX115S3F45I2SGE2 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115S3F45I2SGE2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115S3F45I2SGE2 we delivered, we will accept the replacement or return of the 10AX115S3F45I2SGE2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115S3F45I2SGE2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations