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Name: 10AX115S3F45I2LG
Brand: Intel
SKU: 10AX115S3F45I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115S3F45I2LG

Part No.:: 10AX115S3F45I2LG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115S3F45I2LG.pdf

Description:: IC FPGA 624 I/O 1932FCBGA

In Stock:: 2609

Quantity:: Add To Cart

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10AX115S3F45I2LG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115S3F45I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115S3F45I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115S3F45I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115S3F45I2LG information

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10AX115S3F45I2LG Application Introduction

10AX115S3F45I2LG is a Field Programmable Gate Array (FPGA) device known for its high performance and versatility in digital circuit design. It offers a wide range of features suitable for various applications, including but not limited to telecommunications, automotive, and industrial control systems.

Power Management:

To optimize power management when using 10AX115S3F45I2LG in your design, consider the following:

- Utilize low-power modes: Leverage the power-saving features available in the FPGA, such as clock gating and dynamic voltage and frequency scaling, to minimize power consumption during idle or low-activity periods.

- Efficient power supplies: Design a robust power supply circuitry with adequate voltage regulation and noise filtering to ensure stable and clean power delivery to the FPGA and associated components.

- Power sequencing: Implement proper power sequencing to ensure that different power domains within the FPGA are powered up and down in the correct order, preventing potential issues like latch-up or data corruption.

Signal Integrity:

To maintain signal integrity and reliability in your design with 10AX115S3F45I2LG, consider the following best practices:

- Proper PCB layout: Follow recommended PCB layout guidelines provided by the FPGA manufacturer to minimize signal reflections, crosstalk, and electromagnetic interference (EMI).

- Signal termination: Use appropriate termination techniques, such as series termination resistors or parallel termination schemes, to match impedance and minimize signal reflections at high-speed interfaces.

- Clock distribution: Implement a robust clock distribution network with low skew and jitter to ensure accurate timing synchronization across the FPGA and associated components.

Thermal Management:

Effective thermal management is crucial to prevent overheating and ensure reliable operation of 10AX115S3F45I2LG. Consider the following strategies:

- Heat sinking: Integrate heat sinks or thermal pads on the FPGA package to enhance heat dissipation and reduce junction temperatures, especially in high-power applications or environments with limited airflow.

- Thermal simulation: Perform thermal simulations and analysis to identify hotspots and optimize the placement of critical components, including power regulators, to mitigate thermal gradients and improve overall thermal performance.

- Ambient cooling: Ensure adequate ventilation and airflow within the system enclosure to maintain ambient temperatures within acceptable limits and prevent thermal stress on the FPGA and surrounding components.

Considerations:

When designing with 10AX115S3F45I2LG, it's essential to consider:

- Design validation: Thoroughly test the design under various operating conditions to verify functionality, performance, and reliability, including power consumption, signal integrity, and thermal management aspects.

- Design for manufacturability: Optimize the design for ease of manufacturing and assembly, considering factors such as component placement, routing complexity, and manufacturing tolerances to ensure cost-effective production and consistent quality.

- Compliance and standards: Ensure that the design complies with relevant industry standards and regulations, including EMC/EMI requirements, safety standards, and environmental regulations, to facilitate product certification and market acceptance.

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3. Are the 10AX115S3F45I2LG price and inventory displayed accurate?

The price and inventory of 10AX115S3F45I2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115S3F45I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115S3F45I2LG we delivered, we will accept the replacement or return of the 10AX115S3F45I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115S3F45I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations