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Name: 10AX115S3F45E2SG
Brand: Intel
SKU: 10AX115S3F45E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115S3F45E2SG

Part No.:: 10AX115S3F45E2SG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115S3F45E2SG.pdf

Description:: IC FPGA 624 I/O 1932FCBGA

In Stock:: 3966

Quantity:: Add To Cart

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10AX115S3F45E2SG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX115S3F45E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115S3F45E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115S3F45E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115S3F45E2SG information

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10AX115S3F45E2SG Application Introduction

10AX115S3F45E2SG is a Field-Programmable Gate Array (FPGA) with advanced features, commonly used in high-performance computing and signal processing applications. It offers a large number of logic elements, high-speed interfaces, and embedded memory blocks.

Application Scenario:

In digital signal processing, 10AX115S3F45E2SG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering in real-time applications.

Circuit Design:

To optimize the design using 10AX115S3F45E2SG, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to ensure the stable operation of 10AX115S3F45E2SG and associated components. Utilize voltage regulators and power sequencing circuits to provide clean and stable power supplies.

2. Signal Integrity:

Pay special attention to signal integrity to maintain reliable data transmission between 10AX115S3F45E2SG and external devices. Proper PCB layout, impedance matching, and termination techniques should be employed for high-speed interfaces like DDR memory or PCIe.

3. Thermal Management:

Implement effective thermal management strategies to prevent overheating of 10AX115S3F45E2SG and ensure reliable operation under high computational loads. Utilize heat sinks, thermal vias, and fans to dissipate heat efficiently.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate and stable clock signals for 10AX115S3F45E2SG and synchronous components. Use low-jitter clock sources and proper routing techniques to minimize clock skew and jitter.

5. Board-Level Testing:

Conduct thorough board-level testing and validation to verify the functionality and performance of the design using 10AX115S3F45E2SG. Perform functional testing, timing analysis, and stress testing to ensure reliability and robustness.

Considerations:

When optimizing the design, consider the following factors:

- Resource Utilization: Efficiently utilize the available logic elements, memory blocks, and DSP slices of 10AX115S3F45E2SG to maximize performance and minimize resource usage.

- Timing Constraints: Meet timing constraints by optimizing the placement and routing of critical paths, using proper clock constraints, and applying timing-driven synthesis and optimization techniques.

- I/O Planning: Plan the I/O configuration carefully to ensure compatibility with external interfaces and peripherals. Consider the voltage levels, signal standards, and signal integrity requirements of each I/O pin.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and sensitive data stored in 10AX115S3F45E2SG.

- Design Reusability: Design the system with modularity and scalability in mind to facilitate future upgrades and modifications. Utilize standardized interfaces and protocols to enhance interoperability and reusability.

10AX115S3F45E2SG FAQ

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3. Are the 10AX115S3F45E2SG price and inventory displayed accurate?

The price and inventory of 10AX115S3F45E2SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115S3F45E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115S3F45E2SG we delivered, we will accept the replacement or return of the 10AX115S3F45E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115S3F45E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations