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Name: 10AX115S2F45I2LG
Brand: Intel
SKU: 10AX115S2F45I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115S2F45I2LG

Part No.:: 10AX115S2F45I2LG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115S2F45I2LG.pdf

Description:: IC FPGA 624 I/O 1932FCBGA

In Stock:: 2201

Quantity:: Add To Cart

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10AX115S2F45I2LG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115S2F45I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115S2F45I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115S2F45I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115S2F45I2LG information

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10AX115S2F45I2LG Application Introduction

10AX115S2F45I2LG is a versatile field-programmable gate array (FPGA) chip commonly used in a wide range of electronic design projects. Its high-performance capabilities make it suitable for applications requiring complex digital processing and rapid prototyping.

Design Optimization:

To effectively utilize 10AX115S2F45I2LG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal performance and energy efficiency. Utilize voltage regulators, such as buck or boost converters, to provide stable power supply voltages to 10AX115S2F45I2LG and associated components. Incorporate low-power design techniques, such as clock gating and power gating, to minimize power consumption during idle periods.

2. Signal Integrity:

Optimize signal integrity by carefully designing the PCB layout and minimizing signal routing lengths. Utilize impedance matching techniques, such as controlled impedance traces and termination resistors, to reduce signal reflections and maintain signal integrity. Employ differential signaling for high-speed interfaces to improve noise immunity and reduce electromagnetic interference.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and maintain reliable operation of 10AX115S2F45I2LG and surrounding components. Incorporate thermal vias and heat sinks to dissipate heat away from the FPGA chip and distribute thermal loads evenly across the PCB. Consider ambient temperature conditions and airflow requirements when designing the enclosure or system housing to facilitate proper heat dissipation.

4. Clock Distribution:

Optimize clock distribution to ensure synchronous operation and minimize clock skew within the FPGA design. Utilize clock buffering techniques, such as clock tree synthesis and phase-locked loops (PLLs), to generate stable clock signals with minimal jitter. Implement clock domain crossing (CDC) protocols and synchronization circuits to mitigate timing violations and ensure reliable data transfer between asynchronous clock domains.

5. Design Verification:

Thoroughly verify the FPGA design through simulation and testing to identify and address potential design issues early in the development process. Utilize hardware description languages (HDLs) like Verilog or VHDL to model and simulate the design behavior accurately. Perform functional verification, timing analysis, and board-level testing to validate the functionality, performance, and reliability of the 10AX115S2F45I2LG-based system.

Considerations:

When optimizing the design, it's essential to consider:

- Design Constraints: Account for resource utilization, timing constraints, and I/O requirements when mapping the design onto the 10AX115S2F45I2LG FPGA.

- System Integration: Interface effectively with external components and peripherals, such as sensors, actuators, and communication interfaces, to achieve seamless system integration and functionality.

- Design Scalability: Design the FPGA-based system with scalability in mind to accommodate future expansion and upgrades without requiring significant redesign efforts.

- Design Security: Implement security features, such as encryption algorithms and secure boot mechanisms, to protect the intellectual property (IP) and ensure the integrity of the FPGA configuration.

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3. Are the 10AX115S2F45I2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115S2F45I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115S2F45I2LG we delivered, we will accept the replacement or return of the 10AX115S2F45I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115S2F45I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations