What is the Additional Feature ?

Name: 10AX115S2F45E1SG
Brand: Intel
SKU: 10AX115S2F45E1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115S2F45E1SG

Part No.:: 10AX115S2F45E1SG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115S2F45E1SG.pdf

Description:: IC FPGA 624 I/O 1932FCBGA

In Stock:: 2967

Quantity:: Add To Cart

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10AX115S2F45E1SG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX115S2F45E1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115S2F45E1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115S2F45E1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115S2F45E1SG information

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10AX115S2F45E1SG Application Introduction

10AX115S2F45E1SG is a field-programmable gate array (FPGA) with advanced features, commonly used in high-performance computing, telecommunications, and industrial applications.

Application Scenario:

In telecommunications infrastructure, 10AX115S2F45E1SG can be utilized for signal processing, protocol handling, and network management tasks, ensuring efficient data transmission and system reliability.

Circuit Design:

To optimize the design using 10AX115S2F45E1SG, consider the following techniques:

1. Power Management:

Implement efficient power supply and management solutions to provide stable and clean power to 10AX115S2F45E1SG and associated components. Use low-dropout regulators (LDOs) and bypass capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout, minimizing trace lengths, and using impedance-matched transmission lines for high-speed interfaces. Pay special attention to clock distribution and signal termination to prevent signal degradation and timing errors.

3. Thermal Management:

Optimize thermal performance by incorporating proper heat sinks, thermal vias, and fans to dissipate heat generated by 10AX115S2F45E1SG during operation. Ensure adequate airflow and thermal conduction within the system to prevent overheating and maintain reliable performance.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and synchronous operation of 10AX115S2F45E1SG and connected peripherals. Use clock buffers, phase-locked loops (PLLs), and jitter-reduction techniques to minimize clock skew and improve system timing.

5. I/O Planning:

Carefully plan the I/O assignments and constraints to optimize resource utilization and minimize signal routing congestion. Utilize the advanced I/O features of 10AX115S2F45E1SG, such as LVDS interfaces and high-speed transceivers, for high-bandwidth data transfer and interface compatibility.

Considerations:

When designing with 10AX115S2F45E1SG, keep the following considerations in mind:

- Design Flexibility: Take advantage of the FPGA's reprogrammable nature to iterate and optimize the design for performance, power, and cost efficiency.

- Design Validation: Perform thorough simulations and testing to verify the functionality, timing, and reliability of the design under various operating conditions and use cases.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the FPGA configuration from unauthorized access and tampering.

- Design Documentation: Maintain comprehensive documentation of the design, including schematics, layout files, and design constraints, to facilitate future revisions, troubleshooting, and knowledge transfer.

- Collaboration: Collaborate with stakeholders, including hardware engineers, firmware developers, and system integrators, to ensure seamless integration and interoperability within the overall system architecture.

10AX115S2F45E1SG FAQ

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3. Are the 10AX115S2F45E1SG price and inventory displayed accurate?

The price and inventory of 10AX115S2F45E1SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115S2F45E1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115S2F45E1SG we delivered, we will accept the replacement or return of the 10AX115S2F45E1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115S2F45E1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations