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Name: 10AX115R4F40I3SGE2
Brand: Intel
SKU: 10AX115R4F40I3SGE2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115R4F40I3SGE2

Part No.:: 10AX115R4F40I3SGE2

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115R4F40I3SGE2.pdf

Description:: IC FPGA 342 I/O 1517FCBGA

In Stock:: 3016

Quantity:: Add To Cart

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10AX115R4F40I3SGE2 Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
342
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115R4F40I3SGE2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115R4F40I3SGE2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115R4F40I3SGE2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115R4F40I3SGE2 information

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10AX115R4F40I3SGE2 Application Introduction

10AX115R4F40I3SGE2 is a field-programmable gate array (FPGA) known for its high performance and versatility, widely used in various electronic design projects for its flexibility and scalability.

Application Scenario:

In digital signal processing applications, 10AX115R4F40I3SGE2 can be utilized to implement complex algorithms for tasks such as image processing, audio processing, and communication protocols.

Circuit Design:

To effectively utilize 10AX115R4F40I3SGE2 in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and prolong the battery life if the project is battery-powered. Utilize low-power modes and power gating techniques to minimize power consumption during idle periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and ensure signal integrity. Pay attention to signal routing, ground planes, and decoupling capacitors placement to reduce noise and maintain signal quality.

3. Thermal Management:

Ensure proper thermal management to prevent overheating of 10AX115R4F40I3SGE2 and other critical components. Incorporate heat sinks, thermal vias, and airflow paths in the PCB design to dissipate heat effectively.

4. Clock Distribution:

Design a robust clock distribution network to ensure reliable clock signals reach all relevant components, including the 10AX115R4F40I3SGE2. Use low-skew clock buffers and minimize clock tree skew to maintain synchronization and improve system performance.

5. I/O Optimization:

Optimize the utilization of I/O resources on 10AX115R4F40I3SGE2 by carefully mapping the design to available I/O pins. Group related I/O signals together and utilize high-speed transceivers for applications requiring high-speed serial communication.

Considerations:

When designing with 10AX115R4F40I3SGE2, it's crucial to consider:

- Resource Utilization: Optimize the use of FPGA resources, such as logic elements, memory blocks, and DSP slices, to maximize design efficiency and minimize resource wastage.

- Timing Constraints: Meet timing constraints by carefully analyzing and optimizing critical paths in the design. Utilize timing analysis tools to identify and address timing violations effectively.

- Design Reusability: Modularize the design to enhance reusability and maintainability. Utilize IP cores and design patterns to simplify design implementation and facilitate future iterations or modifications.

- Testing and Validation: Develop comprehensive test benches and validation procedures to ensure the correctness and functionality of the design. Perform rigorous testing at each development stage to identify and resolve issues early.

- Documentation: Maintain thorough documentation throughout the design process to facilitate collaboration, troubleshooting, and future development efforts. Document design specifications, implementation details, and testing procedures comprehensively.

10AX115R4F40I3SGE2 FAQ

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3. Are the 10AX115R4F40I3SGE2 price and inventory displayed accurate?

The price and inventory of 10AX115R4F40I3SGE2 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115R4F40I3SGE2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115R4F40I3SGE2 we delivered, we will accept the replacement or return of the 10AX115R4F40I3SGE2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115R4F40I3SGE2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations