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Name: 10AX115R4F40I3LG
Brand: Intel
SKU: 10AX115R4F40I3LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115R4F40I3LG

Part No.:: 10AX115R4F40I3LG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115R4F40I3LG.pdf

Description:: IC FPGA 342 I/O 1517FBGA

In Stock:: 3748

Quantity:: Add To Cart

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10AX115R4F40I3LG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
342
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115R4F40I3LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115R4F40I3LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115R4F40I3LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115R4F40I3LG information

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10AX115R4F40I3LG Application Introduction

10AX115R4F40I3LG is a Field-Programmable Gate Array (FPGA) chip designed by Intel, offering high performance and versatility for a wide range of applications, from telecommunications to automotive systems.

Application Scenario:

In telecommunications infrastructure, 10AX115R4F40I3LG can be utilized for tasks such as signal processing, encryption, and network packet routing.

Circuit Design:

To optimize the design using 10AX115R4F40I3LG, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation. Utilize power gating and dynamic voltage scaling to adapt to varying workload demands and extend battery life in portable applications.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and electromagnetic interference. Follow best practices for high-speed digital design, such as impedance matching, signal termination, and ground plane layout, to maintain signal integrity and reliability.

3. Thermal Management:

Ensure adequate thermal dissipation to prevent overheating and maintain reliable operation. Incorporate heat sinks, thermal vias, and proper airflow in the system design to dissipate heat generated by the 10AX115R4F40I3LG chip and other components.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter, ensuring synchronous operation of the FPGA and associated components. Use low-skew clock buffers, differential signaling, and proper termination techniques to maintain timing accuracy and maximize system performance.

5. System Integration:

Integrate the 10AX115R4F40I3LG FPGA seamlessly into the overall system architecture, considering compatibility with other components and interfaces. Implement robust communication protocols, such as PCIe or Ethernet, for efficient data transfer and interoperability with external devices or networks.

Considerations:

When designing with 10AX115R4F40I3LG, keep in mind:

- Design Constraints: Understand the limitations and constraints of the FPGA, such as logic capacity, I/O resources, and maximum operating frequency, to optimize resource utilization and performance.

- Design Verification: Thoroughly verify the design through simulation, prototyping, and testing to ensure functional correctness, timing closure, and compliance with specifications.

- Design Iteration: Iterate on the design to refine performance, optimize resource utilization, and address any issues or limitations encountered during development.

- Documentation: Maintain comprehensive documentation of the design, including schematics, PCB layout files, firmware code, and design constraints, to facilitate future revisions, debugging, and maintenance.

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3. Are the 10AX115R4F40I3LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115R4F40I3LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115R4F40I3LG we delivered, we will accept the replacement or return of the 10AX115R4F40I3LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115R4F40I3LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations