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Name: 10AX115R3F40I2SGES
Brand: Intel
SKU: 10AX115R3F40I2SGES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115R3F40I2SGES

Part No.:: 10AX115R3F40I2SGES

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115R3F40I2SGES.pdf

Description:: IC FPGA 342 I/O 1517FCBGA

In Stock:: 3009

Quantity:: Add To Cart

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10AX115R3F40I2SGES Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
342
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115R3F40I2SGES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115R3F40I2SGES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115R3F40I2SGES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115R3F40I2SGES information

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10AX115R3F40I2SGES Application Introduction

10AX115R3F40I2SGES is a highly advanced FPGA (Field-Programmable Gate Array) device, renowned for its flexibility and performance in various electronic design projects.

Application Scenarios:

In digital signal processing applications, 10AX115R3F40I2SGES can be utilized to implement complex algorithms for tasks such as image processing, audio filtering, and communication protocols.

Design Optimization:

To optimize the design using 10AX115R3F40I2SGES, consider the following techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal utilization of resources on 10AX115R3F40I2SGES. Utilize power-saving modes and dynamic voltage scaling to minimize power consumption during idle or low-load periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure reliable signal integrity. Utilize techniques such as controlled impedance routing, signal shielding, and proper ground plane design to mitigate signal integrity issues.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and ensure reliable operation of 10AX115R3F40I2SGES. Utilize heatsinks, thermal vias, and proper airflow design to dissipate heat generated during operation.

4. Resource Utilization:

Optimize resource utilization by efficiently mapping the design onto 10AX115R3F40I2SGES. Utilize logic synthesis and optimization techniques to minimize resource usage while meeting performance requirements.

5. Clock Management:

Implement robust clocking architectures to ensure accurate timing and synchronization in 10AX115R3F40I2SGES-based designs. Utilize PLLs (Phase-Locked Loops) and clock distribution networks to generate and distribute clock signals efficiently.

Considerations:

When designing with 10AX115R3F40I2SGES, it's essential to consider:

- Design Constraints: Ensure that the design meets timing, area, and power constraints specified for 10AX115R3F40I2SGES.

- Design Validation: Perform thorough functional and timing analysis to validate the design and ensure correct operation under all operating conditions.

- Design Security: Implement security features such as bitstream encryption and authentication to protect the intellectual property programmed onto 10AX115R3F40I2SGES.

- Design Debugging: Provide sufficient debug interfaces and instrumentation to facilitate debugging and troubleshooting during development and testing phases.

- Future Expansion: Design the system with scalability in mind to accommodate future enhancements or modifications to the functionality implemented on 10AX115R3F40I2SGES.

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3. Are the 10AX115R3F40I2SGES price and inventory displayed accurate?

The price and inventory of 10AX115R3F40I2SGES fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115R3F40I2SGES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115R3F40I2SGES we delivered, we will accept the replacement or return of the 10AX115R3F40I2SGES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115R3F40I2SGES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations