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Name: 10AX115R3F40I2SG
Brand: Intel
SKU: 10AX115R3F40I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115R3F40I2SG

Part No.:: 10AX115R3F40I2SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115R3F40I2SG.pdf

Description:: IC FPGA 342 I/O 1517FBGA

In Stock:: 3184

Quantity:: Add To Cart

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10AX115R3F40I2SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
342
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115R3F40I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115R3F40I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115R3F40I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115R3F40I2SG information

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10AX115R3F40I2SG Application Introduction

10AX115R3F40I2SG is a Field-Programmable Gate Array (FPGA) device with advanced capabilities, commonly used in various electronic design projects for its flexibility and performance.

Application Scenario:

In telecommunications infrastructure, 10AX115R3F40I2SG can be utilized to implement signal processing algorithms for data transmission and reception in wireless communication systems.

Circuit Design:

To design a signal processing system using 10AX115R3F40I2SG, consider the following aspects:

1. Power Management:

Ensure efficient power supply design to provide stable voltage levels to 10AX115R3F40I2SG and associated components. Use voltage regulators and decoupling capacitors to minimize noise and ensure reliable operation.

2. Signal Integrity:

Implement proper signal conditioning techniques, such as impedance matching and transmission line design, to maintain signal integrity during high-speed data transmission within the FPGA and with external devices.

3. Thermal Management:

Design adequate heat dissipation mechanisms, such as heat sinks or thermal vias, to prevent overheating of 10AX115R3F40I2SG during operation, especially in high-performance applications.

4. Clocking Strategy:

Develop a robust clocking strategy to ensure synchronous operation of internal logic blocks and external interfaces. Utilize PLLs (Phase-Locked Loops) for clock generation and distribution, considering factors like skew and jitter.

5. Design Optimization:

Optimize the FPGA design by leveraging its reconfigurable nature and parallel processing capabilities. Implement efficient algorithms and parallel processing architectures to maximize performance and resource utilization.

Considerations:

When designing with 10AX115R3F40I2SG, it's crucial to consider:

- Resource Utilization: Efficiently allocate FPGA resources, such as logic cells and memory blocks, to meet performance requirements and minimize resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that the design meets timing constraints and achieves the desired operating frequency.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect intellectual property and prevent unauthorized access or tampering with the FPGA configuration.

- Design Verification: Conduct comprehensive functional verification and simulation to validate the correctness and reliability of the FPGA design under various operating conditions.

- Design Documentation: Maintain detailed documentation of the FPGA design, including block diagrams, timing diagrams, and interface specifications, to facilitate future maintenance and troubleshooting.

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6. What is the process for return or replacement of 10AX115R3F40I2SG?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115R3F40I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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