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Name: 10AX115R3F40E2SG
Brand: Intel
SKU: 10AX115R3F40E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115R3F40E2SG

Part No.:: 10AX115R3F40E2SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115R3F40E2SG.pdf

Description:: IC FPGA 342 I/O 1517FBGA

In Stock:: 2921

Quantity:: Add To Cart

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10AX115R3F40E2SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
342
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX115R3F40E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115R3F40E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115R3F40E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115R3F40E2SG information

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10AX115R3F40E2SG Application Introduction

10AX115R3F40E2SG is a field-programmable gate array (FPGA) with advanced capabilities, widely used in various electronic design projects for its flexibility and performance.

Application Scenario:

In digital signal processing applications, 10AX115R3F40E2SG can be utilized to implement complex algorithms for tasks such as image processing or wireless communication protocols.

Circuit Design:

To effectively utilize 10AX115R3F40E2SG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization in your design. Utilize power gating and dynamic voltage scaling where appropriate to minimize power consumption while maintaining performance.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing the PCB layout and minimizing signal reflections and crosstalk. Use impedance matching techniques and proper termination schemes to maintain signal quality, especially in high-speed interfaces.

3. Thermal Management:

Manage the thermal performance of 10AX115R3F40E2SG by incorporating adequate heat dissipation mechanisms into your design. Utilize heatsinks, thermal vias, and fans to prevent overheating and ensure reliable operation, especially under high computational loads.

4. Clocking Strategy:

Design a robust clocking strategy to ensure synchronous operation and minimize clock skew in your FPGA design. Use clock distribution networks effectively and carefully analyze timing constraints to optimize performance and reliability.

5. Resource Utilization:

Optimize resource utilization in 10AX115R3F40E2SG by employing efficient coding techniques and maximizing parallelism where possible. Utilize FPGA resources such as lookup tables (LUTs) and dedicated DSP blocks judiciously to achieve the desired functionality while minimizing resource consumption.

Considerations:

When designing with 10AX115R3F40E2SG, it's essential to consider:

- Design Flexibility: Leverage the reconfigurability of FPGAs to adapt to evolving design requirements and optimize performance.

- Design Validation: Thoroughly validate your FPGA design through simulation and prototyping to ensure functional correctness and performance objectives are met.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect the intellectual property and integrity of your FPGA design.

- Design for Testability: Incorporate built-in self-test (BIST) features and boundary scan testing to facilitate testing and debugging of your FPGA design during development and production.

- Design Documentation: Maintain comprehensive documentation of your FPGA design, including design specifications, constraints, and verification test plans, to aid in design maintenance and future revisions.

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3. Are the 10AX115R3F40E2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115R3F40E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115R3F40E2SG we delivered, we will accept the replacement or return of the 10AX115R3F40E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115R3F40E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations