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Name: 10AX115R2F40E2SG
Brand: Intel
SKU: 10AX115R2F40E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115R2F40E2SG

Part No.:: 10AX115R2F40E2SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115R2F40E2SG.pdf

Description:: IC FPGA 342 I/O 1517FBGA

In Stock:: 3614

Quantity:: Add To Cart

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10AX115R2F40E2SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
342
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX115R2F40E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115R2F40E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115R2F40E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115R2F40E2SG information

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10AX115R2F40E2SG Application Introduction

10AX115R2F40E2SG is a Field-Programmable Gate Array (FPGA) device known for its high performance and versatility in various electronic applications. It offers a wide range of features, including programmable logic blocks, embedded memory, and configurable I/Os, making it suitable for diverse design requirements.

Application Scenario:

In digital signal processing applications, 10AX115R2F40E2SG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 10AX115R2F40E2SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of power resources within the FPGA device. Utilize dynamic voltage and frequency scaling (DVFS) algorithms to adjust the operating voltage and frequency dynamically based on the computational workload.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and other sources of noise that could degrade signal integrity. Use proper termination techniques, impedance matching, and signal routing guidelines to maintain signal integrity throughout the system.

3. Thermal Management:

Implement effective thermal management strategies to prevent overheating and ensure reliable operation of 10AX115R2F40E2SG under varying environmental conditions. Use thermal vias, heat sinks, and fans to dissipate heat generated by the FPGA device and surrounding components.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate timing synchronization and clock skew minimization within the FPGA device. Use clock conditioning circuits, such as PLLs and DLLs, to generate stable clock signals with low jitter and phase noise.

5. Design for Testability:

Include built-in self-test (BIST) features and diagnostic circuits within the FPGA design to facilitate efficient testing and debugging during the development phase. Implement boundary scan chains and on-chip monitoring circuits to monitor internal signals and detect potential faults.

Considerations:

When designing with 10AX115R2F40E2SG, it's essential to consider:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic cells, memory blocks, and DSP slices, to minimize resource wastage and maximize performance.

- Timing Closure: Ensure that the design meets timing constraints and achieves timing closure during the synthesis and implementation stages. Use timing analysis tools to identify critical paths and optimize for maximum operating frequency.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and prevent unauthorized access to the FPGA configuration data.

- System Integration: Integrate 10AX115R2F40E2SG seamlessly into the overall system architecture, considering compatibility with other components, interfaces, and communication protocols.

- Future Scalability: Design the system with scalability in mind to accommodate future upgrades and enhancements, such as additional functionality or increased processing capabilities.

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3. Are the 10AX115R2F40E2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115R2F40E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115R2F40E2SG we delivered, we will accept the replacement or return of the 10AX115R2F40E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115R2F40E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations