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Name: 10AX115N4F45I3SGES
Brand: Intel
SKU: 10AX115N4F45I3SGES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 10AX115N4F45I3SGES

Part No.:: 10AX115N4F45I3SGES

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115N4F45I3SGES.pdf

Description:: IC FPGA 768 I/O 1932FBGA

In Stock:: 2328

Quantity:: Add To Cart

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10AX115N4F45I3SGES Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
768
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115N4F45I3SGES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115N4F45I3SGES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115N4F45I3SGES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115N4F45I3SGES information

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10AX115N4F45I3SGES Application Introduction

10AX115N4F45I3SGES is a field-programmable gate array (FPGA) known for its high performance and flexibility, commonly used in various digital design projects for its versatility and reliability.

Application Scenario:

In digital signal processing applications, 10AX115N4F45I3SGES can be utilized to implement complex algorithms for audio processing, image processing, and communications systems.

Circuit Design:

To optimize the design utilizing 10AX115N4F45I3SGES, consider the following aspects:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage levels and minimize power consumption of the 10AX115N4F45I3SGES device and associated peripherals. Utilize low-dropout voltage regulators and power gating techniques to reduce standby power consumption.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and impedance mismatches. Use impedance-controlled routing for high-speed interfaces and incorporate termination resistors where necessary to maintain signal integrity.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX115N4F45I3SGES to prevent overheating and ensure reliable operation. Use heat sinks, thermal vias, and proper airflow in the enclosure design to dissipate heat effectively. Monitor the temperature of the device and implement thermal throttling mechanisms if needed.

4. Clock Distribution:

Design a robust clock distribution network to provide stable clock signals to the 10AX115N4F45I3SGES device and synchronize various modules within the FPGA design. Use low-skew clock routing techniques and incorporate PLLs or DLLs for clock synthesis and synchronization.

5. Design Partitioning:

Break down the FPGA design into smaller, manageable modules to facilitate design reuse, parallel development, and easier debugging. Utilize hierarchical design methodologies and IP cores to optimize resource utilization and improve design scalability.

Considerations:

When optimizing the FPGA design, consider the following factors:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic cells, memory blocks, and DSP slices, to minimize area usage and meet performance requirements.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that the design meets timing constraints and achieves the desired operating frequency.

- Design Verification: Implement comprehensive verification strategies, including simulation, formal verification, and hardware-in-the-loop testing, to validate the functionality and correctness of the FPGA design.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect the intellectual property and prevent unauthorized access or tampering of the FPGA design.

- Design Documentation: Maintain detailed documentation throughout the design process, including design specifications, test plans, and implementation notes, to facilitate design reviews and future revisions.

10AX115N4F45I3SGES FAQ

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3. Are the 10AX115N4F45I3SGES price and inventory displayed accurate?

The price and inventory of 10AX115N4F45I3SGES fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115N4F45I3SGES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115N4F45I3SGES we delivered, we will accept the replacement or return of the 10AX115N4F45I3SGES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115N4F45I3SGES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations